BLM15PD300SN1D Murata, BLM15PD300SN1D Datasheet - Page 4

EMI/RFI Suppressors & Ferrites 0402 30ohms

BLM15PD300SN1D

Manufacturer Part Number
BLM15PD300SN1D
Description
EMI/RFI Suppressors & Ferrites 0402 30ohms
Manufacturer
Murata
Type
Chip Beadr
Datasheet

Specifications of BLM15PD300SN1D

Product
Chip Ferrite Beads
Impedance
30 Ohms
Tolerance
25 %
Maximum Dc Resistance
0.035 Ohms
Package / Case
0402 (1005 metric)
Inductance
Not RequireduH
Core Material
Ferrite
Tolerance (+ Or -)
25%
Dc Resistance
35mOhm
Case Size (inches)
0402in
Operating Temp Range
-55C to 125C
Test Frequency
100MHz
Dc Current
2.2A
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
0.55mm
Product Depth (mm)
0.55mm
Product Length (mm)
1mm
Military Standard
Not Required
Failure Rate
Not Required
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLM15PD300SN1D
Manufacturer:
MURATA
Quantity:
10 000
Part Number:
BLM15PD300SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
I !Caution/Notice
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
o
!Caution (Rating)
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
Do not use products beyond the rated current as
this may create excessive heat and deteriorate
the insulation resistance.
Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead
http://www.murata.com/
Data Sheet
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
2010.11.4
4

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