BLM18AG471SH1D Murata, BLM18AG471SH1D Datasheet - Page 72

• Manufacturer Part Number: BLM18AG471SH1D
• Description: EMI/RFI Suppressors & Ferrites 0603 470ohms Gen Use Tape
• Manufacturer: Murata
• Series: BLM Ar

Specifications of BLM18AG471SH1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 470 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.5 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Frequency Range: 30MHz To 100MHz
• Dc Resistance Max: 0.35ohm
• Dc Current Rating: 500mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• Operating Temperature Min: -55°C
• Rohs Compliant: Yes
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
70
3. Standard Soldering Conditions
(1) Soldering Methods
Solder: H60A H63A solder (JIS Z 3238)
(2) Soldering Profile
Chip EMIFILr (Soldering and Mounting)
oFlow Soldering profile
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Continued from the preceding page.
*
BLM
(Except BLM15)
NFE61H*
(Eutectic solder, Sn-3.0Ag-0.5Cu solder)
Except NFE61HT332
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
In case of lead-free solder, use Sn-3.0Ag-0.5Cu
solder. Use of Sn-Zn based solder will deteriorate
performance of products. If using NFM series with
Sn-Zn based solder, please contact Murata in
advance.
T1
Temp. (T1)
150 C
Pre-heating
Pre-heating
Time. (t1)
t1
min.
60s
T3
T2
Temp. (T2)
250 C 4 to 6s
Standard Profile
Heating
Heating
t2
Time. (t2)
time (s)
times
max.
Cycle
of flow Temp. (T3) Time. (t2)
2
Limit Profile
Standard Profile
265
3 C
Heating
Limit Profile
max.
5s
times
of flow
max.
Cycle
2
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
oReflow Soldering profile
qSoldering profile for Lead-free solder (Sn-3.0Ag-0.5Cu)
wSoldering profile for Eutectic solder
In case of DLW31/43 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
exceeding 0.20wt%)
BLM, NFE
NFM,
DLW31S
DLW43S
BLM, NFE
NFM, DLW
(Limit profile: refer to q)
Series
Series
180
150
T1
Temp. (T1) Time. (t1)
220 C
min.
Heating
Temp. (T1) Time. (t1)
150 C
Standard Profile
Pre-heating
Pre-heating
30 to
90s 30s
60s
t1
T2
T1
T3
T2
temperature
min.
60s
245
Peak
3 C
(T2)
of reflow
2 times
Temp. (T2) Time. (t2)
183 C
t1
t2
Cycle
max.
t2
min.
Heating
Continued on the following page.
Temp. (T3) Time. (t2)
230 C
240 C
min.
min.
time (s)
time (s)
Standard Profile
T4
T3
Heating
max.
60s
Limit Profile
Standard Profile
Standard Profile
Limit Profile
max.
max.
60s
30s
temperature
230 C
Peak
(T3)
temperature
260 C
260 C
Peak
/10s
(T4)
2 times
of reflow
Cycle
of reflow
max.
2 times
Cycle
max.
C50E.pdf
08.8.28