BLM18HE152SN1D Murata, BLM18HE152SN1D Datasheet - Page 6

• Manufacturer Part Number: BLM18HE152SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 1500ohms
• Manufacturer: Murata
• Type: Chip Beadr

Specifications of BLM18HE152SN1D

• Product: Chip Ferrite Beads
• Impedance: 1.5 KOhms
• Tolerance: 25 %
• Maximum Dc Resistance: 0.5 Ohms
• Package / Case: 0603 (1608 metric)
• Inductance: Not RequireduH
• Core Material: Ferrite
• Tolerance (+ Or -): 25%
• Dc Resistance: 500mOhm
• Case Size (inches): 0603in
• Operating Temp Range: -55C to 125C
• Test Frequency: 100MHz
• Dc Current: 500mA
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Product Length (mm): 1.6mm
• Military Standard: Not Required
• Failure Rate: Not Required
• Dc: 10+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

I !Caution/Notice
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
o
!Caution (Rating)
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
Do not use products beyond the rated current as
this may create excessive heat and deteriorate
the insulation resistance.
Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead for GHz Noise
http://www.murata.com/
Data Sheet
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
2011.5.12
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