BLM21BD272SH1L Murata, BLM21BD272SH1L Datasheet - Page 74

• Manufacturer Part Number: BLM21BD272SH1L
• Description: EMI/RFI Suppressors & Ferrites 0805 2.7Kohms HiSpd Signal Line Tape
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM21BD272SH1L

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 2.7 KOhms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.8 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0805 (2012 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.8ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0805 / 2012
• Operating Temperature Max: +125°C
• Operating Temperature Min: -55°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Standard Land Pattern Dimensions
2. Solder Paste Printing and Adhesive Application
3. Standard Soldering Conditions
(1) Soldering Methods
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
72
Block Type EMIFILr SMD Type (Soldering and Mounting)
BNX024H
BNX025H
BNX024H
BNX025H
BNX024H/025H is only for reflow soldering.
exceeding 0.20wt%)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oUse Sn-3.0Ag-0.5Cu pattern printing solder.
oCoat with solder paste to the following thickness:
150-200 m
12.5
10.2
9.9
9.6
7.1
6.2
5.3
2.8
2.3
0
12.5
10.2
9.6
7.1
5.3
2.8
2.3
0
PSG
Solder Paste Printing
PSG
B
B
CG
CG
CG
CG
CB
CG
CB
CG
(1) A double-sided print board (or multilayer board) as shown in
(2) Please drop CG on a ground electrode on the back layer
(3) It is recommended to use a double-sided printed circuit
(4) The ground pattern should be designed to be as large as
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
possible to achieve maximum filtering performance.
Adhesive Application
Continued on the following page.
Land Pattern
+ Solder Resist
Land Pattern
Through Hole
(in mm)
(in mm)
C50E.pdf
08.8.28