BLM18HD471SN1D Murata, BLM18HD471SN1D Datasheet - Page 144
![EMI/RFI Suppressors & Ferrites 0603 470 OHM](/photos/16/33/163388/lpmuratablm_sml.jpg)
BLM18HD471SN1D
Manufacturer Part Number
BLM18HD471SN1D
Description
EMI/RFI Suppressors & Ferrites 0603 470 OHM
Manufacturer
Murata
Specifications of BLM18HD471SN1D
Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
470 Ohms
Tolerance
25 %
Maximum Dc Current
100 mAmps
Maximum Dc Resistance
1.2 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
1.2ohm
Dc Current Rating
100mA
Ferrite Mounting
SMD
Ferrite Case Style
0603
Inductor Case Style
0603
No. Of Pins
2
Core Material
Ferrite
Resistance
1.2ohm
Rohs Compliant
Yes
Operating Temperature Min
-55°C
Operating Temperature Max
+125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM18HD471SN1D
Manufacturer:
MURATA
Quantity:
240 000
Part Number:
BLM18HD471SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
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!Note
142
NFW31S
NFE31P
NFE61P
NFA
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
150-200 m
150-200 m
0.25
NFA21S
NFA18S
NFA31G/31C
0.175
0.5
0.05
Solder Paste Printing
0.3
1.5
0.25
1.375
1.3
2.0
0.4
1.5
4.8
8.8
0.5
2.6
0.6
2.2
4.2
0.225
0.8 Pitch
0.6
Apply 1.0mg of bonding agent at each chip.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
NFp Chip EMIFILr
Bonding agent
Bonding agent
Adhesive Application
Soldering and Mounting
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
Mar.28,2011
C31E.pdf
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