CSPEMI201AG ON Semiconductor, CSPEMI201AG Datasheet - Page 5

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CSPEMI201AG

Manufacturer Part Number
CSPEMI201AG
Description
EMI/RFI Suppressors & Ferrites Audio Filter Speaker
Manufacturer
ON Semiconductor
Datasheet

Specifications of CSPEMI201AG

Capacitance
100 pF
Circuit Type
Pi Filter
Shielding
Unshielded
Product
EMI Filters
Maximum Dc Resistance
10 Ohms
Operating Temperature Range
- 40 C to + 85 C
Package / Case
CSP-5
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CSPEMI201AG
Manufacturer:
ON/安森美
Quantity:
20 000
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
© 2008 California Micro Devices Corp. All rights reserved.
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
PRINTED CIRCUIT BOARD RECOMMENDATIONS
250
200
150
100
50
Non-Solder Mask Defined Pad
0
Figure 4. Lead-free (SnAgCu) Solder
Solder Stencil Opening
Solder Mask Opening
1:00.0
0.275mm DIA.
0.330mm DIA.
0.325mm DIA.
Ball Reflow Profile
Issue B – 06/23/08
Time (minutes)
2:00.0
Tel: 408.263.3214
3:00.0
4:00.0
Fax: 408.263.7846
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.325mm Round
0.330mm Round
50/50 by volume
CSPEMI201A
60 seconds
0.275mm
No Clean
VALUE
Round
+50μm
+20μm
260°C
www.cmd.com
5

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