BLM21BB121SN1D Murata, BLM21BB121SN1D Datasheet - Page 142
![EMI/RFI Suppressors & Ferrites 0805 120 OHM](/photos/16/33/163388/lpmuratablm_sml.jpg)
BLM21BB121SN1D
Manufacturer Part Number
BLM21BB121SN1D
Description
EMI/RFI Suppressors & Ferrites 0805 120 OHM
Manufacturer
Murata
Series
BLM Br
Specifications of BLM21BB121SN1D
Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
120 Ohms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.25 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0805 (2012 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.25ohm
Dc Current Rating
200mA
Ferrite Mounting
SMD
Ferrite Case Style
0805
Inductor Case Style
0805
No. Of Pins
2
Core Material
Ferrite
Rohs Compliant
Yes
Operating Temperature Min
-55°C
Resistance
0.25ohm
Operating Temperature Max
+125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM21BB121SN1D
Manufacturer:
MURATA
Quantity:
240 000
Part Number:
BLM21BB121SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
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o
!Note
140
NFA18S
NFA21S
NFA31G
NFA31C
NFW31S
NFE31P
NFE61P
PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Reflow Soldering
R0.1 to R0.2 is preferred to obtain
high voltage withstanding
o Reflow Soldering NFA31G/31C
o Reflow Soldering
2.0
4.8
8.8
Small diameter thru hole ø0.4
0.05
0.5
0.175
0.3
0.225
NFA18S
1.375
2.35
0.4
1.3
2.0
2.6
3.8
4.2
0.8 Pitch
Filled via
ø0.1
ø0.4
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Small diameter thru hole ø0.2
Poor example
o Reflow and Flow NFW31S
o Reflow Soldering NFE31P
o Flow Soldering
NFp Chip EMIFILr
Small diameter thru hole ø0.4
1.5
3.8
4.8
9.0
Small diameter thru hole ø0.4
0.6
1.2
2.2
4.2
NFA21S
0.25
Soldering and Mounting
2.5
1.5
0.25
Good example
b
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
a
(in mm)
Mar.28,2011
C31E.pdf
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