BLM18TG102TN1D Murata, BLM18TG102TN1D Datasheet - Page 180

• Manufacturer Part Number: BLM18TG102TN1D
• Description: EMI/RFI Suppressors & Ferrites 1K OHM LOW SPEED SIGNAL
• Manufacturer: Murata

Specifications of BLM18TG102TN1D

• Product: Chip Ferrite Beads
• Impedance: 1 KOhms
• Tolerance: 25 %
• Maximum Dc Resistance: 0.6 Ohms
• Package / Case: 0603 (1608 metric)
• Dc Resistance Max: 0.6ohm
• Dc Current Rating: 100mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

(1) Soldering Methods
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
(2) Soldering Profile
!Note
178
3. Standard Soldering Conditions
oFlow Soldering Profile
oReflow Soldering Profile
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering
common mode choke
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
(Sn-3.0Ag-0.5Cu Solder)
(Sn-3.0Ag-0.5Cu Solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
DLM/DLP
DLW21/31
DLW5A/5B
solder will deteriorate performance of products.
If using DLP/DLM series with Sn-Zn based solder,
please contact Murata in advance.
DLM2HG
DLP31D/31S
Series
Series
coils.
220 C min.
220 C min.
Temp. (T1)
Temp. (T1)
150 C
180
150
Heating
T1
Pre-heating
30 to 60s
30 to 60s
Time. (t1)
Standard Profile
Time. (t1)
60s min.
Pre-heating
Pre-heating
chip
90s 30s
t1
Temperature
T3
T2
T2
T1
DLp Chip Common Mode Choke Coil
245 3 C
250 3 C
Peak
Temp. (T2)
(T2)
Heating
250 C
t1
t2
t2
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Heating
Standard Profile
of Reflow
Time (s)
time (s)
2 times
2 times
converting chlorine content of 0.06 to 0.1wt%.
cleaned completely with no residual flux.
exceeding 0.20wt%)
Cycle
T4
T3
In case of DLW21/31 series, use Rosin-based flux with
In case of using RA type solder, products should be
max.
max.
Time. (t2)
4 to 6s
Limit Profile
Standard Profile
Limit Profile
Standard Profile
230 C min.
230 C min.
Temp. (T3)
2 times
of Flow
Cycle
max.
Heating
60s max.
60s max.
Time. (t2)
Temp. (T3)
265 3 C
Limit Profile
Heating
Temperature
Soldering and Mounting
260 C/10s
260 C/10s
Limit Profile
Time. (t2)
Peak
5s max.
(T4)
of Reflow
2 times
2 times
Cycle
of Flow
2 times
max.
max.
Cycle
max.
Mar.28,2011
C31E.pdf