BLM21BD182SN1D Murata, BLM21BD182SN1D Datasheet - Page 93

EMI/RFI Suppressors & Ferrites 0805 1.8Kohms HiSpd Signal Line Tape

BLM21BD182SN1D

Manufacturer Part Number
BLM21BD182SN1D
Description
EMI/RFI Suppressors & Ferrites 0805 1.8Kohms HiSpd Signal Line Tape
Manufacturer
Murata
Series
BLM Br
Datasheets

Specifications of BLM21BD182SN1D

Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
1.8 KOhms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.5 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0805 (2012 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.5ohm
Dc Current Rating
200mA
Ferrite Mounting
SMD
Ferrite Case Style
0805
Inductor Case Style
0805
No. Of Pins
2
Core Material
Ferrite
Resistance
0.5ohm
Rohs Compliant
Yes
Operating Temperature Min
-55°C
Operating Temperature Max
+125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLM21BD182SN1D
Manufacturer:
MURATA
Quantity:
240 000
BL
!Note
BLA2A
BLA31
1. Standard Land Pattern Dimensions
BLM02
BLM03
BLM15
(Except BLM
15_AN1 series)
BLM18
BLM21
BLM31
BLM41
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
p
Chip Ferrite Bead
oReflow and Flow
oReflow Soldering
BLM Series
And BLM02/03/15/18G is specially adapted for reflow
soldering.
Except BLM03PG/15AX·PD·PG/18PG·KG·SG/21PG.
BLM02
BLM03
BLM15
BLM18
BLM21
Type
BLA2A
(except 18G)
Soldering
Reflow
Reflow
Reflow
Reflow
Reflow
Flow/
Flow
0.5 Pitch
a
b
0.16-0.2
1.75
0.2-0.3
0.4
0.7
1.2
a
0.25
Soldering and Mounting
0.4-0.56
0.6-0.9
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
b
• If there are high amounts of self-heating on pattern, the
contact points of PCB and part may become damaged.
0.2-0.23
0.3
0.5
0.7
1.0
c
oReflow and Flow
BLM03AX
BLM03PG
BLM15AX
BLM15Pp
BLM18PG
BLM18KG
BLM18SG
BLM21PG
BLM31PG
BLM41PG
Do not apply narrower pattern than listed above to
BLMppAX/P/K/S.
Narrow pattern can cause excessive heat or open circuit.
BLMppAX/P/K/S
Type
1.5max.
2.2max.
BLA31
0.5-1.5
1.7-2.5
1max.
Current
1.5/2
1.5/2
Rated
3-4
1.5
(A)
6
2
3
6
3
6
3
6
Soldering
Reflow
Reflow
Reflow
0.8 Pitch
Flow/
2.8
0.2-0.3
0.4
0.7
1.2
2.0
3.0
a
a
b
0.4
3.0-4.0
4.2-5.2
5.5-6.5
0.6-0.9
1.2-1.4
2.2-2.6
Reflow
1.8-2.0
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
Flow
b
0.3
0.5
0.7
1.0
1.2
c
Land Pad Thickness
18 m 35 m 70 m
0.3
0.5
1.2
0.7
1.2
2.4
6.4
1.0
1.2
2.4
6.4
1.2
2.4
6.4
1.2
2.4
6.4
and Dimension d
0.3
0.5
0.7
0.7
0.7
1.2
3.3
1.0
1.0
1.2
3.3
1.2
1.2
3.3
1.2
1.2
3.3
1.65
1.65
1.65
1.65
0.3
0.5
0.5
0.7
0.7
0.7
1.0
1.0
1.0
1.2
1.2
1.2
1.2
(in mm)
91
Mar.28,2011
C31E.pdf

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