BLM31BE601SN1L Murata, BLM31BE601SN1L Datasheet - Page 185

• Manufacturer Part Number: BLM31BE601SN1L
• Description: EMI/RFI Suppressors & Ferrites 1206 600 OHM
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM31BE601SN1L

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 300 mAmps
• Maximum Dc Resistance: 0.35 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 1206 (3216 metric)
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
NFW31S
NFE31P
NFE61P
NFA
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
pattern printing.
150-200 m
pattern printing.
150-200 m
pattern printing.
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
0.3
0.175
NFA31G/31C
0.05
2.6
NFA18S
1.375
0.4
1.3
2.0
Solder Paste Printing
0.8 pitch
0.6
0.225
0.6
2.2
4.2
1.5
4.8
8.8
0.25
0.5
1.5
0.25
NFA21S
0.5
EMIFILr (Soldering and Mounting)
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
Apply 1.0mg of bonding agent at each chip.
Bonding agent
Bonding agent
Adhesive Application
Continued on the following page.
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
183
C31E.pdf
08.9.1
6