BLM21BD601SN1D Murata, BLM21BD601SN1D Datasheet - Page 144
BLM21BD601SN1D
Manufacturer Part Number
BLM21BD601SN1D
Description
EMI/RFI Suppressors & Ferrites 0805 600 OHM
Manufacturer
Murata
Series
BLM Br
Specifications of BLM21BD601SN1D
Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
600 Ohms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.35 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0805 (2012 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.35ohm
Dc Current Rating
200mA
Ferrite Mounting
SMD
Ferrite Case Style
0805
Inductor Case Style
0805
No. Of Pins
2
Core Material
Ferrite
Rohs Compliant
Yes
Operating Temperature Min
-55°C
Resistance
0.35ohm
Operating Temperature Max
+125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM21BD601SN1D
Manufacturer:
Murata Electronics North Ameri
Quantity:
33 351
Part Number:
BLM21BD601SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
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!Note
142
NFW31S
NFE31P
NFE61P
NFA
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
150-200 m
150-200 m
0.25
NFA21S
NFA18S
NFA31G/31C
0.175
0.5
0.05
Solder Paste Printing
0.3
1.5
0.25
1.375
1.3
2.0
0.4
1.5
4.8
8.8
0.5
2.6
0.6
2.2
4.2
0.225
0.8 Pitch
0.6
Apply 1.0mg of bonding agent at each chip.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
NFp Chip EMIFILr
Bonding agent
Bonding agent
Adhesive Application
Soldering and Mounting
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
Mar.28,2011
C31E.pdf
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