42817-0031 Molex Inc, 42817-0031 Datasheet - Page 7

Headers & Wire Housings PIN 8 12+12 AWG

42817-0031

Manufacturer Part Number
42817-0031
Description
Headers & Wire Housings PIN 8 12+12 AWG
Manufacturer
Molex Inc
Series
Mini-Fit Sr. Seriesr
Type
Maler
Datasheet

Specifications of 42817-0031

Contact Gender
Pin (Male)
Termination Style
Crimp
Contact Material
High Performance Alloy (HPA)
Contact Plating
Tin
Current Rating
50 A
Wire Size (awg)
8
Awg
8
Contact Termination
Crimp
Rohs Compliant
Yes
Product
Crimp Terminals
Insulation
Not Insulated
Gender
Male
Mounting Angle
Straight
Mounting Method
Wire
Number Of Positions / Contacts
1
Number Of Rows
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
Mini-Fit Sr. Connectors
Other names
428170031

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
42817-0031
Manufacturer:
MOLEX
Quantity:
39 960
Part Number:
42817-0031
Manufacturer:
MOLEX
Quantity:
35 000
5.3 ENVIRONMENTAL PERFORMANCE (cont.)
**NOTE : This product is compatible with lead-free hand soldering temperatures.
REVISION:
DOCUMENT NUMBER:
16
5.3.6
5.3.6A
5.3.7
5.3.8
5.3.9
5.3.10
Section
PS-42815-001
ECR/ECN INFORMATION:
EC No:
DATE:
Immunity to
Fretting
Corrosion
without
lubrication. (tin)
Not
Recommended
Immunity to
Fretting
Corrosion with
lubrication. (tin)
(Nyogel 760G)
Temp. Rise &
Current Cycling
Solderability**
IR Process
Resistance
Resistance to
Solder**
UCP2007-0850
2006 / 10 / 05
Item
PRODUCT SPECIFICATION
Mate connectors, expose to 500 cycles
with a max. transition time of 5 minutes
between extremes.
+25 +/- 10 deg. C for 30 minutes
+70 +3/-0 deg. C for 30 minutes
Mate connectors, expose to 500 cycles
with a max. transition time of 5 minutes
between extremes.
+25 +/- 10 deg. C for 30 minutes
+70 +3/-0 deg. C for 30 minutes
Mate the connectors and measure the
temperature rise at the rated current
for 96 hrs., 45 minutes ON and 15
minutes OFF for 240 hrs., and an
additional 96 hrs. of steady-state
current.
Solder time: 3 +/- 5 seconds
Solder temp.: 260 +/- 5 deg. C
245 +/- 3 deg. C for 4 minutes, allow to
cool to room temperature, repeat for 3
cycles.
(To deter blistering of housing, parts should
be baked for a minimum of 24 hours at 125
+5/-0 deg. C)
Solder time: 3 +/- 0.5 seconds
Solder temp.: 260 +/- deg. C
TITLE:
CREATED / REVISED BY:
M. CARRANZA
PRODUCT SPECIFICATION FOR MINI-
Test Condition
FIT SR. CONNECTOR SYSTEM
CHECKED BY:
J. COMERCI
Appearance: No
damage
Contact Res. change
= 4.0mOhm max
Appearance: No
damage
Contact Res. change
= 1.0mOhm max
Max. Temp. Rise =
30deg. C
Per EIA 364 and CSA
requirement
95% of the immersed
area must show no
voids or pin holes.
Appearance: No
damage
Dimensional:
Conformance to sales
drawing requirements.
Appearance: No
damage
Requirement
APPROVED BY:
J. COMERCI
FILENAME: PS42815.DOC
SHEET No.
7
of
8

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