FTR-LYCA012Y Fujitsu, FTR-LYCA012Y Datasheet - Page 7
![General Purpose / Industrial Relays 12 VDC 1 Form C Silver Alloy Contact](/photos/17/54/175424/ftr-ly_sml.jpg)
FTR-LYCA012Y
Manufacturer Part Number
FTR-LYCA012Y
Description
General Purpose / Industrial Relays 12 VDC 1 Form C Silver Alloy Contact
Manufacturer
Fujitsu
Series
FTR-LYr
Datasheet
1.FTR-LYCA012Y.pdf
(8 pages)
Specifications of FTR-LYCA012Y
Contact Form
SPDT
Coil Voltage
12 V
Contact Rating
6 A
Contact Termination
Solder
Mounting Style
PCB
Power Consumption
170 mW
Contact Material
Silver
Coil Resistance
847 Ohms
Coil Type
Standard
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FTR-LYCA012Y
Manufacturer:
INFINEON
Quantity:
23 000
RoHS Compliance and Lead Free Information
1. General Information
l
l
l
l
2. Recommended Lead Free Solder Profile
l
3. Moisture Sensitivity
l
4. Tin Whiskers
l
Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
We highly recommend that you confirm your actual solder conditions
(Amendment to Directive 2002/95/EC)
This material has been verified to be compatible with PbSn assembly process.
Recommended solder Sn-3.0Ag-0.5Cu.
Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC
Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
including amendments.
maximum 120˚C
dip within 5 sec. at
260˚C solder bath
maximum 360˚C
maximum 3 sec.
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