MAX6581TG9A+ Maxim Integrated Products, MAX6581TG9A+ Datasheet - Page 2

Board Mount Temperature Sensors 1 C ACCUR 8-CH TEMP SENSR

MAX6581TG9A+

Manufacturer Part Number
MAX6581TG9A+
Description
Board Mount Temperature Sensors 1 C ACCUR 8-CH TEMP SENSR
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX6581TG9A+

Full Temp Accuracy
+/- 1 C
Package / Case
TQFN-24
Digital Output - Bus Interface
I2C
Digital Output - Number Of Bits
11 bit
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Description/function
Multichannel Temperature Sensor
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Current
4 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
±1°C Accurate 8-Channel Temperature Sensor
ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND)
V
DXP_ to GND ............................................ -0.3V to (V
DXN_ to GND ........................................... -0.3V to (V
SMBDATA, ALERT, OVERT Current .................. -1mA to +50mA
DXN_ Current .................................................................... Q1mA
Continuous Power Dissipation (T
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Standby Supply Current
Operating Current
Temperature Resolution
3-Sigma Temperature Accuracy
(Remote Channels 1–7)
3-Sigma Temperature Accuracy
(Local)
6-Sigma Temperature Accuracy
(Remote Channels 1–7)
6-Sigma Temperature Accuracy
(Local)
Supply Sensitivity of
Temperature Accuracy
CC
24-Pin Thin QFN (derate 27.8mW/NC above +70NC) .. 2222mW
OVERT, STBY to GND ..........................................-0.3V to +4V
CC
______________________________________________________________________________________
, SMBCLK, SMBDATA, ALERT,
= +3.0V to +3.6V, T
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= -40NC to +125NC, unless otherwise noted. Typical values are at V
A
= +70NC)
SYMBOL
I
I
V
CC1
CC2
I
SS
CC
SMBus static
During conversion, RC off
During conversion, RC on
V
V
V
V
CC
CC
CC
CC
CC
CC
= 3.3V
= 3.3V
= 3.3V
= 3.3V
+ 0.3V)
+ 0.3V)
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
CONDITIONS
A
RJ
A
A
RJ
A
A
A
A
RJ
A
A
RJ
A
A
A
, T
, T
= +30NC to +85NC,
= +30NC to +85NC,
= +30NC to +85NC,
= +30NC to +85NC,
= +30NC to +85NC
= -40NC to +125NC
= 0NC to +150NC
= +30NC to +85NC
= -40NC to +125NC
= 0NC to +150NC
= +60NC to +100NC
= +100NC to +150NC
= +60NC to +100NC
= +100NC to +125NC
RJ
RJ
Package Junction-to-Ambient Thermal Resistance
Package Junction-to-Case Thermal Resistance
ESD Protection (all pins, Human Body Model) ...................Q2kV
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range .......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
(B
(B
= -40NC to +125NC
= -40NC to +125NC
JA
JC
) (Note 1) ............................................................36.0NC/W
) (Note 1) ..............................................................3.0NC/W
CC
-0.85
-2.75
MIN
-1.2
-2.5
-1.5
-2.5
-3.5
3.0
= +3.3V and T
-1
-2
-3
-1
-2
0.125
Q0.2
TYP
500
550
11
4
A
= +25NC.) (Note 2)
+0.85
+2.75
MAX
+1.2
+2.5
+1.5
+2.5
+3.5
600
650
3.6
15
+1
+2
+3
+1
+2
UNITS
NC/V
Bits
FA
FA
NC
NC
NC
NC
NC
V

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