24-7068-1406 Kester, 24-7068-1406 Datasheet
24-7068-1406
Specifications of 24-7068-1406
24-7068-1406 Summary of contents
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RECOMMENDED Electronics Assembly Materials ...
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... Lead-free wave and selective soldering require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuring reliable product output. ...
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... K100LD has the Lowest Copper Dissolution amongst all common solder alloys, including SN63, SAC305, and other lead-free options. Kester K100LD provides the lowest cost for wave soldering operations. It also provides solder joints with no shrinkage effects, excellent through-hole penetration and topside fillet, and provides a low dross rate ...
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... Flux designator ORH1 Diameter Core Size .020 66 24-7068-7603 .025 66 24-7068-7617 .031 66 24-7068-7601 .050 66 24-7068-7606 .062 66 24-7068-7607 Diameter Core Size .020 66 24-7068-1401 .025 66 24-7068-1406 .031 66 24-7068-1402 .050 66 24-7068-1404 .062 66 24-7068-1400 Diameter Core Size 24-7068-6401 .020 66 24-7068-6417 .025 66 24-7068-6403 .031 66 24-7068-6409 .050 66 24-7068-6411 ...
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... Metal % Suggested 35g and 100g syringes Packaging Style *For lead based products, Kester produces solder powder to J-STD-006B for alloy purity and particle distribution, except for Antimony, which is specified to a maximum of 0.2%. Solder Paste for Stencil Printing Applications HydroMark 531 ® Easy Profile ...
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... Solder Paste Kester Part # Description 7002020510 Easy Profile 256HA No-Clean, Type 3, 90% metal ® Easy Profile 256HA No-Clean, Type 3, 90% metal 7002020310 ® 7002020511 Easy Profile 256HA No-Clean, Type 3, 90% metal ® Easy Profile 256HA No-Clean, Type 3, 90% metal 7002020311 ® ...
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... Kester Solder Analysis Program Kester's Solder Analysis Program is a prepaid method for rapid response solder sample analysis. It allows customers to document solder pot impurities for conformance to Federal Specifications or ISO quality requirements. Option C: This option includes monitoring tin, antimony, copper, gold, lead, cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel ...
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... Solder Wire "245" No-Clean "245" halide-free; rosin based no-clean core flux that provides excellent wetting combined with optimal reliability and cosmetics. "245" is compliant to Bellcore GR-78-CORE and is classified as ROL0 per J-STD-004. “245” No-Clean Core 1 lb. Part # Alloy Diameter 24-6337-8806 Sn63Pb37 .015 Sn63Pb37 ...
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... Telcordia Issue 1 GR-78-CORE & ANSI/J-STD-004 Flux designator ORL0 Wash with hot de-ionized water at 140-160°F or use 1% solution of Kester's #5768 Bio-Kleen ® saponifier in water. De-ionized Water PS-20 Packaging 1 gallon 5 gallon 53 gallon drum ...
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... Water-Soluble 5 gallon 2331-ZX Water-Soluble 53 gallon drum 2235 Water-Soluble 1 gallon 2235 Water-Soluble 5 gallon 2235 Water-Soluble 53 gallon drum 2120 Water-Soluble 1 gallon 2120 Water-Soluble 5 gallon 2120 Water-Soluble 53 gallon drum 2120 Organic Water-Soluble 24 670 0.862 ± 0.005 Halide-Free IPC/J-STD-004 Flux designator ORH0 4662 ...
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... IPC/J-STD-004 IPC/J-STD-004 Flux designator ROL0 Flux designator ROM1 Residue is non-corrosive, but may be removed with solvent or with Kester’s 5768 Bio-Kleen ® saponifier at 7-10% saponifier at 7-10% solution in de-ionized or soft water at temperatures of 120-140°F. temperatures of 120-140°F. 120 104 ...
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... Good control is necessary to assure a consistent amount of flux is applied to the circuit boards, consistent soldering results are obtained, and the least amount of flux residue remains after soldering. Kester PS-20 and PS-22 flux kits provide a simple method for process control. Kester Part # ...
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... Kester Tacky Soldering Fluxes Kester's TSFs are the industry standard for attachment of spheres to BGA and µBGA packages. The TSFs are also used in electronics assembly opera- tions to solder flip chip components to PWB substrates. Kester's TSF portfolio includes a complete line of no clean and water-soluble products capable of being screen and stencil printed, dot dispensed, or thin film transfer processed ...
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... Stampings ® TC-564-1 Water Soluble Temporary Solder Mask Kester's best selling temporary solder mask specially designed to effectively protect printed circuit boards that require masking during wave soldering operations. TC-564-1 can be used with any type of flux: rosin, organic or inor- ganic and can also be washed away in any appropriate cleaning equipment. ...
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... EniviroMark™ 907, EnviroMark™ 828 186, 1544, 2120, Easy Profile 256 & 256HA ® 2331-ZX, 2235, 2224-25, HydroMark 531, TSF 6592LV, 2222, 2220-VF TSF 6800 Series Base metal must be plated. 2222, 2220-VF Call Kester's Customer Service Base metal must be plated ...
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... To achieve this we will focus on customer-driven innovation and exceptional service worldwide. ASIA-PACIFIC ASIA-PACIFIC HEADQUARTERS HEADQUARTERS Singapore Singapore 500 Chai Chee Lane Singapore 4690224 Phone: (+65) 6 449-1133 Fax: (+65) 6 242-9036 Email: customerservice@kester.com.sg Japan 20-11 YokoKawa 2-Chome, Sumida-ku Tokyo 130, Japan Tel: (+81) 3-3624-5351 Fax (+81) 3-3626-6253 Email: jpsales@kester.com.sg B ...