WS488-SAC305-45-SC10 AIM - American Iron and Metal, WS488-SAC305-45-SC10 Datasheet

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WS488-SAC305-45-SC10

Manufacturer Part Number
WS488-SAC305-45-SC10
Description
Solder, Fluxes & Accessories WS488 SOLDER PASTE 10 CC SYRINGE
Manufacturer
AIM - American Iron and Metal
Datasheet
1.WS488-SAC305-45-SC10.pdf (3 pages)

Specifications of WS488-SAC305-45-SC10

Product
Fluxes & Pastes
Alloy
SAC305
Description/function
Solder Paste in 10 cc Syringe
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Squeegee Pressure
Squeegee Speed
Snap-off Distance
Features:
- Excellent Wetting
- Extended Cleaning Window
Description:
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces,
components, assemblies, and substrates.
characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been
developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product
was created to meet the industry’s demand for a consistently reliable water soluble product.
Printing:
-
-
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Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and
they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak
temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller
assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards.
The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all
influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-
couples attached is recommended to optimize the process.
PARAMETER
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16
mm (½ to ⅝ inch) is normally sufficient to begin).
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and
workable properties.
WS488 provides the necessary tack time and force for today’s high speed placement equipment, which will
enhance product performance and reliability.
0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
12-150 mm/sec (.5-6”/sec)
On Contact 0.00 mm (0.00”)
RECOMMENDED INITIAL SETTINGS
- 8 Hour + Stencil Life
- Superior Slump Resistance
Water Soluble Solder Paste
WS488 offers superior slump resistance, as well as excellent print
SAC305
WS488
PCB Separation Distance
PCB Separation Speed
PARAMETER
Slow
0.75-2.0 mm (.030-.080”)
RECOMMENDED INITIAL SETTINGS
- Aqueous Wash with Water
- Large Process Window

WS488-SAC305-45-SC10 Summary of contents

Page 1

... AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product was created to meet the industry’ ...

Page 2

... Stencil Cleaner - Cleaning: WS488 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required. ...

Page 3

... Test Data Summary: CLASSIFICATION Product IPC Classification to J-STD-004 Name WS488 ORM1 POWDER TESTING No. Item 1 Powder Size 2 Powder Shape FLUX MEDIUM TESTING No. Item 1 Acid Value 2 Fluorides Spot Test 3 Corrosivity Test/ Copper Mirror 4 Halide-Free/Silver Chromate Paper Test Surface Insulation Resistance (Solder paste was reflowed on test coupons, ...