NCV8537MN500R2G ON Semiconductor, NCV8537MN500R2G Datasheet - Page 16

• Manufacturer Part Number: NCV8537MN500R2G
• Description: Low Dropout (LDO) Regulators LDO
• Manufacturer: ON Semiconductor

Specifications of NCV8537MN500R2G

• Number Of Outputs: 1
• Input Voltage Max: 16 V
• Output Voltage: 5 V
• Output Type: Fixed
• Dropout Voltage (max): 340 mV
• Output Current: 700 mA
• Load Regulation: 0.04 mV/mA
• Voltage Regulation Accuracy: +/- 0.9 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Package / Case: DFN10
• Primary Input Voltage: 12V
• Output Voltage Fixed: 5V
• Dropout Voltage Vdo: 340mV
• No. Of Pins: 10
• Voltage Regulator Case Style: DFN
• Operating Temperature Range: -40°C To +125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
L
K
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
*For additional information on our Pb−Free strategy and soldering
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.5651
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
C
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
10X
SEATING
PLANE
2.1746
MOLD CMPD
http://onsemi.com
0.3008
L1
DFN10, 3x3, 0.5P
CASE 485C−01
10X
A1
ISSUE B
Bottom View
SOLDERING FOOTPRINT*
(Optional)
DETAIL A
16
É É É
É É É
É É É
(Optional)
Side View
DETAIL B
EDGE OF PACKAGE
2.6016
EXPOSED Cu
DIMENSIONS: MILLIMETERS
0.5000 PITCH
A3
1.8508
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
b
D
E
K
L
e
3.3048
MILLIMETERS
0.80
0.00
0.18
2.40
1.70
0.35
0.00
MIN
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
1.00
0.05
0.30
2.60
1.90
0.45
0.03
NCV8537/D