GCM1885G1H681JA16D Murata Electronics North America, GCM1885G1H681JA16D Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/4/466/murata_electronics_north_america_sml.jpg)
GCM1885G1H681JA16D
Manufacturer Part Number
GCM1885G1H681JA16D
Description
CAP CER 680PF 50V X8G SMD
Manufacturer
Murata Electronics North America
Series
GCMr
Datasheet
1.GCM0335C1ER30CD03D.pdf
(66 pages)
Specifications of GCM1885G1H681JA16D
Voltage - Rated
50V
Lead Style
*
Capacitance
680pF
Tolerance
±5%
Temperature Coefficient
X8G
Mounting Type
*
Operating Temperature
-55°C ~ 150°C
Applications
Automotive
Ratings
AEC-Q200
Package / Case
*
Size / Dimension
*
Thickness
*
Lead Spacing
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
18
19
20 Beam Load Test
*1: The figure indicates typical specification. Please refer to individual specifications.
Continued from the preceding page.
Board
Flex
Terminal
Strength
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
AEC-Q200
Test Item
Appearance
Capacitance
Change
Q/D.F.
I.R.
Appearance
Capacitance
Change
Q/D.F.
I.R.
Temperature Compensating Type
No marking defects
Within 5.0% or 0.5pF
(Whichever is larger)
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
More than 10,000M or 500 · F
(Whichever is smaller)
No marking defects
Within the specified tolerance
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
More than 10,000M or 500 · F
(Whichever is smaller)
The chip endure following force.
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Specifications
*1
Within 10.0%
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
High Dielectric Type
GCM Series Specification and Test Methods
100
Fig. 1
C
a
b
t: 1.6mm
(GCM03/15: 0.8mm)
*1
*1
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5 1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM03/15)
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length: 2.5mm max. >
Speed supplied the Stress Load: 0.5mm / sec.
< Chip Length: 3.2mm min. >
Speed supplied the Stress Load: 2.5mm / sec.
Specifications and Test Methods
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
Type
Type
R4
Capacitance meter
45
AEC-Q200 Test Method
Fig. 3
20
Fig. 4
0.3
0.5
0.6
0.8
2.0
2.0
0.3
0.4
1.0
1.2
2.2
2.2
a
a
L
114
0.6
Fig. 2
45
Continued on the following page.
Pressunzing
speed: 1.0mm/sec
Pressurize
Iron Board
Flexure: V2
(High Dielectric Type)
Flexure: V3
(Temperature
Compensating Type)
0.9
1.5
2.2
3.0
4.4
4.4
0.9
1.5
3.0
4.0
5.0
5.0
b
b
Solder resist
Baked electrode or
copper foil
c
(t=1.6mm
GCM03/15: 0.8mm)
1.65
0.3
0.6
0.9
1.3
1.7
2.6
0.3
0.5
1.2
2.0
2.9
c
c
(in mm)
(in mm)
C03E.pdf
17
10.5.20
1