GRM219C81A475KE34J Murata Electronics North America, GRM219C81A475KE34J Datasheet - Page 186
GRM219C81A475KE34J
Manufacturer Part Number
GRM219C81A475KE34J
Description
CAP CER X6S 0805
Manufacturer
Murata Electronics North America
Series
GRMr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM219C81A475KE34J
Voltage - Rated
10V
Lead Style
*
Capacitance
4.7µF
Tolerance
±10%
Temperature Coefficient
X6S
Mounting Type
*
Operating Temperature
-55°C ~ 105°C
Applications
General Purpose
Package / Case
*
Size / Dimension
*
Thickness
*
Lead Spacing
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
- Current page: 186 of 221
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
11 Deflection
12
13
14
15
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Only for Camera Flash Circuit Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within T10%
0.025 max.
CU0.01 F: More than 100M • F
CF0.01 F: More than 10,000M
In accordance with item No.4
No marking defects
Within T7.5%
0.025 max.
CU0.01 F: More than 100M • F
CF0.01 F: More than 10,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
CU0.01 F: More than 10M • F
CF0.01 F: More than 1,000M
In accordance with item No.4
2.0Z1.25
3.2Z1.6
LZW
(mm)
1.2
2.2
a
d
Specifications
100
b
a
c
Fig. 2
Dimension (mm)
4.0
5.0
b
4.5
t : 1.6
1.65
2.0
c
GR7 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor at 120 to 150D for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
#Pretreatment
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
#Pretreatment
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Step
W24
Y
1
2
3
4
0
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Room Temp.
Room Temp.
45
Fig. 3
Fig. 4
Test Method
20 50
45
Continued on the following page.
Pressurize
Pressurizing
speed: 1.0mm/s
W
Y10
W
Y10
W
Y10
0
0
0
Flexure=1
D for 60T5 min. and then
D for 60T5 min. and then
D for 60T5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
30T3
2 to 3
30T3
2 to 3
185
C02E.pdf
10.12.20
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