R75MD2100AA40J Kemet, R75MD2100AA40J Datasheet - Page 9

• Manufacturer Part Number: R75MD2100AA40J
• Description: CAP .01UF 400V METAL POLYPRO
• Manufacturer: Kemet
• Series: MKPr

Specifications of R75MD2100AA40J

• Capacitance: 10000pF
• Voltage - Ac: 220V
• Voltage - Dc: 400V
• Dielectric Material: Polypropylene, Metallized
• Tolerance: ±5%
• Operating Temperature: -55°C ~ 105°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Termination: PC Pins
• Features: EMI Suppression
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Size / Dimension: -
• Height: -
• Lead Spacing: -
• Other names: 399-5900

ElECtRICAl CHARACtERIStICS
Rated voltage (V
Rated temperature (t
temperature derated voltage:
The following decreasing factor has to be applied on the
rated voltage:
+85°C to +105°C: 2.00% per °C for V
+85°C to +105°C: 1.25% per °C for V
Capacitance range:
1000 pF to 33µF
1000 pF to 2.2µF
Capacitance values:
E12 series (IEC 60063 Norm).
Capacitance tolerances (measured at 1 kHz):
±5% (J); ±10% (K); ±20% (M).
total self-inductance (L): (Lead length ~2 mm)
dissipation factor (dF):
tgδx10
Insulation resistance:
test voltage between terminations:
1.6xV
kHz
Pitch (mm)
100
test conditions
Temperature:
Voltage charge time: 1min
Voltage charge:
Performance
≥1x10
≥30000 s
* Typical value.
L (nH) ≈
10
1
R
-4
applied for 2 s at +25°C±5°C
at +25°C±5°C
C≤0.1µF
5
MΩ for C≤0.33µF (5x10
≤04
≤06
≤25
160Vdc - 250Vdc - 400Vdc - 630Vdc -1000Vdc
1250Vdc - 1600Vdc - 2000Vdc
for 1 section.
for 3 sections.
for C >0.33µF (150000 s)*
7.5
R
8
):
for 1 section.
for 3 sections.
0.1<C≤1.0
R
): +85°C
10
≤5
≤8
9
+25±C°5°C
100Vdc
µ
F
15
10
5
1<C≤4.7
MΩ)*
R
R
22.5
(d.c.)
(a.c.)
18
≤6
µ
F
27.5
18
C>4.7
≤10
37.5
20
µ
F
113
HIGH PERFORMANCES
MEtAllIzEd POlyPROPylENE FIlM CAPACItOR
d.C. ANd PUlSE APPlICAtIONS
PRODUCT CODE: R75 (digit 12: 0 to 9)
tESt MEtHOd ANd PERFORMANCE
damp heat, steady state:
Endurance:
Resistance to soldering heat:
long term stability (after two years):
test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|: ≤2%
DF change (∆tgδ):
Insulation resistance:
test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|: ≤3%
DF change (∆tgδ):
Insulation resistance: ≥50% of initial limit.
test conditions
Solder bath temperature:
Dipping time (with heat screen):10 s±1 s
Performance
Capacitance change |∆C/C|: ≤1%
DF change (∆tgδ):
Insulation resistance:
Storage: standard environmental conditions (see page 12)
Performance
Capacitance change |∆C/C|: ≤0.5%
≤10x10
≤10x10
≤10x10
≤10x10
+40°C±2°C
93% ±2%
56 days
≤10x10
≥50% of initial limit.
+85°C±2°C
2000 h
1.25xV
+260°C±5°C
≥initial limit.
-4
-4
-4
-4
at 10kHz for C≤1µF
at 10kHz for C≤1µF
at 01kHz for C>1µF
at 01kHz for C>1µF
R
-4
at 1kHz
MKP Series
R75
09/2008