MF-SM013/250V-2 Bourns Inc., MF-SM013/250V-2 Datasheet - Page 2
![FUSE RESETTABLE](/photos/1/32/13228/mf-sm013_250-2_sml.jpg)
MF-SM013/250V-2
Manufacturer Part Number
MF-SM013/250V-2
Description
FUSE RESETTABLE
Manufacturer
Bourns Inc.
Series
MF-SMr
Type
Telecom PTC Resettable Fusesr
Specifications of MF-SM013/250V-2
Package / Case
Non-Standard SMD
Voltage - Max
250V
Current - Max
3A
Current - Hold (ih) (max)
130mA
R Min/max
6.500 ~ 12.00 Ohm
Hold Current
0.13 Amp
Trip Current
0.26 Amp
Current Rating (max)
3 Amps
Resistance
12 Ohms
Maximum Voltage
60 VoltsDC
Termination Style
SMD/SMT
Mounting Style
SMD/SMT
Current Rating
3 Amps
Dimensions
6.6 mm L x 3.2 mm W x 7.4 mm H
Lead Spacing
1.53 mm
Operating Temperature Range
- 40 C to + 85 C
Holding Current
130mA
Initial Resistance Max
12ohm
Operating Voltage
60V
Ptc Fuse Case
SMD
External Depth
7.4mm
External Width
6.6mm
Initial Resistance Min
6.5ohm
Length/height, External
3.2mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Trip (it)
-
Time To Trip
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MF-SM013/250V-2
Manufacturer:
BOURNS
Quantity:
1 365
The recommended long term storage conditions for Multifuse
remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage recommendations are
exceeded. Devices stored in this manner have an indefinite shelf life.
Packaging:
TAPE & REEL: 1000 pcs. per reel
Solder Reflow Recommendations
Product Dimensions
Storage Recommendations
300
250
200
150
100
50
0
MF-SM013/250V Series -
(.260)
6.6
(.076)
1.94
MAX.
Preheating
160–220
Time (seconds)
(.126)
MAX.
(.291)
3.2
MAX.
7.4
Terminal material:
Tin-plated brass
Soldering
10–20
Telecom PTC Resettable Fuses
Cooling
®
120
Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices should
Recommended Pad Layout
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
Rework
• A device should not be reworked.
meet the performance requirements.
board.
(.090)
2.29
Customers should verify actual device performance in their specific applications.
(.095)
2.41
(.250)
6.35
(.095)
2.41
(.090)
2.29
Specifications are subject to change without notice.
(.135)
3.43
DIMENSIONS =
(INCHES)
MM