KMC8144TVT1000B Freescale Semiconductor, KMC8144TVT1000B Datasheet - Page 77

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KMC8144TVT1000B

Manufacturer Part Number
KMC8144TVT1000B
Description
IC DSP 783FCPBGA
Manufacturer
Freescale Semiconductor
Series
MSC81xx StarCorer
Type
SC3400 Corer
Datasheet

Specifications of KMC8144TVT1000B

Interface
EBI/EMI, Ethernet, I²C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
Clock Rate
1.0GHz
Non-volatile Memory
ROM (96 kB)
On-chip Ram
10.5MB
Voltage - I/o
3.30V
Voltage - Core
1.00V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
783-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
KMC8144TVT1000B
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
5
6
Freescale Semiconductor
MSC8144 Technical Data Sheet (MSC8144). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8144 device.
MSC8144 Reference Manual (MSC8144RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8144 device.
SC3400 DSP Core Reference Manual. Covers the SC3400 core architecture, control registers, clock registers, program
control, and instruction set.
MSC8144 SC3400 DSP Core Subsystem Reference Manual. Covers core subsystem architecture, functionality, and
registers.
Package Information
Product Documentation
Figure 44. MSC8144 Mechanical Information, 783-ball FC-PBGA Package
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 16
CASE NO. 1842-04
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
3. Maximum solder ball diameter
4. Datum A, the seating plane, is
5. Parallelism measurement
6. Capacitors may not be present
7. Caution must be taken not to
Package Information
per ASME Y14.5M–1994.
measured parallel to Datum A.
determined by the spherical
crowns of the solder balls.
should exclude any effect of
marking.
on all devices.
short exposed metal capacitor
pads on package top.
77

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