XC3S50AN-4FTG256C Xilinx Inc, XC3S50AN-4FTG256C Datasheet - Page 72
XC3S50AN-4FTG256C
Manufacturer Part Number
XC3S50AN-4FTG256C
Description
IC FPGA SPARTAN-3AN 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Specifications of XC3S50AN-4FTG256C
Number Of Logic Elements/cells
1584
Number Of Labs/clbs
176
Total Ram Bits
55296
Number Of I /o
195
Number Of Gates
50000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S50AN-4FTG256C
Manufacturer:
Xilinx Inc
Quantity:
10 000
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Chapter 7: Power Management
Thermal Considerations
72
Figure 7-1: ISF Memory Enters Standby Mode when CSB is High Longer than 35 μs
The ISF memory has negligible effect on the thermal considerations for the FPGA. The
junction temperature of the ISF memory will be the same as the junction temperature
calculated for the FPGA.
CSB
www.xilinx.com
ISF memory selected
Active Mode
(10 to 15 mA)
Spartan-3AN FPGA In-System Flash User Guide
35 μs
UG333 (v2.1) January 15, 2009
Standby Mode
(100 μA)
UG333_c8_01_082307
R
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