XC3S50AN-4FTG256I Xilinx Inc, XC3S50AN-4FTG256I Datasheet - Page 61

• Manufacturer Part Number: XC3S50AN-4FTG256I
• Description: IC FPGA SPARTAN-3AN 256FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S50AN-4FTG256I

• Number Of Logic Elements/cells: 1584
• Number Of Labs/clbs: 176
• Total Ram Bits: 55296
• Number Of I /o: 195
• Number Of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Spartan-3AN FPGA In-System Flash User Guide
UG333 (v2.1) January 15, 2009
Operation Timing
R
A Low-to-High transition on the CSB input completes the command and the Flash then
erases the selected block of 8 pages. The erase operation is internally self-timed and
completes in the time shown in
sheet. During this time, the
whether the Sector Erase operation is in progress or whether it has completed.
Table 5-13: Sector Erase Time
While the Sector Erase operation is in progress, the FPGA can access any other portion of
the ISF memory, including any of the following commands.
•
•
•
Symbol
Read from or write to an SRAM page buffer, which are not used during an erase
operation.
♦
♦
Status Register Read
Information Read
T
SE
Buffer Read
Buffer Write
Sector Erase Time
Description
www.xilinx.com
READY/BUSY
Table 5-13
and specified in the
bit (bit 7) of the
XC3S1400AN
XC3S200AN
XC3S400AN
XC3S700AN
XC3S50AN
FPGA
Status Register
Typ
Spartan-3AN FPGA data
0.8
1.6
Max
2.5
5
indicates
Sector Erase
seconds
seconds
Units
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