MC56F8257MLH Freescale Semiconductor, MC56F8257MLH Datasheet - Page 51

• Manufacturer Part Number: MC56F8257MLH
• Description: DSC 64K FLASH 60MHZ 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8257MLH

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• Ram Size: 4K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Product: DSCs
• Processor Series: 56800E
• Core: 56800E
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 54
• Data Ram Size: 8 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Freescale Semiconductor
Junction to package top
Junction to package top
Junction-to-ambient thermal resistance determined per JEDEC JESD51–3 and JESD51–6.
Thermal test board meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51–8. Thermal test
board meets JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1.
The cold plate temperature is used for the case temperature. Reported value includes the
thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the
package top and the junction temperature per JEDEC JESD51–2. When Greek letters are
not available, the thermal characterization parameter is written as Psi-JT.
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Natural convection
Natural convection
Natural convection
Natural convection
Junction to board
Junction to board
Junction to case
Junction to case
Characteristic
Characteristic
(@200 ft/min)
(@200 ft/min)
(@200 ft/min)
(@200 ft/min)
Table 20. 48LQFP Package Thermal Characteristics
Table 21. 64LQFP Package Thermal Characteristics
MC56F825x/MC56F824x Digital Signal Controller, Rev. 3
Natural Convection
Natural convection
Single layer board
Single layer board
Single layer board
Single layer board
Four layer board
Four layer board
Four layer board
Four layer board
Comments
Comments
(2s2p)
(2s2p)
(2s2p)
(2s2p)
(1s)
(1s)
(1s)
(1s)
NOTE
Symbol
Symbol
R
R
R
R
R
R
R
R
R
R
R
R
JMA
JMA
JMA
JMA
JMA
JMA
JT
JT
JC
JC
JA
JB
JA
JB
(LQFP)
(LQFP)
Value
Value
67
48
60
44
24
15
67
48
55
42
31
14
2
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Specifications
51