PCA82C250T/YM,115 NXP Semiconductors, PCA82C250T/YM,115 Datasheet
PCA82C250T/YM,115
Specifications of PCA82C250T/YM,115
Related parts for PCA82C250T/YM,115
PCA82C250T/YM,115 Summary of contents
Page 1
PCA82C250 CAN controller interface Rev. 06 — 26 March 2009 1. General description The PCA82C250 is the interface between a CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability ...
Page 2
... NXP Semiconductors 5. Ordering information Table 2. Ordering information Type number Package Name PCA82C250T SO8 6. Block diagram Fig 1. 7. Pinning information 7.1 Pinning Fig 2. PCA82C250_6 Product data sheet Description plastic small outline package; 8 leads; body width 3 TXD 8 SLOPE/ Rs STANDBY HS 4 RXD 5 REFERENCE V ref ...
Page 3
... NXP Semiconductors 7.2 Pin description Table 3. Symbol TXD GND V CC RXD V ref CANL CANH Rs 8. Functional description The PCA82C250 is the interface between a CAN protocol controller and the physical bus primarily intended for high-speed automotive applications ( MBd). The device provides differential transmit capability to the bus and differential receive capability to the CAN controller fully compatible with the “ ...
Page 4
... NXP Semiconductors LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slow in Standby mode, the first message will be lost. Table 4. Supply 4 5 5.5 V < (not powered < < don’t care. ...
Page 5
... NXP Semiconductors 10. Thermal characteristics Table 7. Symbol R th(j-a) 11. Characteristics Table 8. Characteristics V = 4 +125 amb ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter Supply I supply current 3 DC bus transmitter ...
Page 6
... NXP Semiconductors Table 8. Characteristics …continued V = 4 +125 amb ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design, but only 100 % tested at +25 C. Symbol Parameter V LOW-level output voltage OL R input resistance i R differential input resistance ...
Page 7
... NXP Semiconductors Fig 3. Fig 4. Fig 5. PCA82C250_6 Product data sheet + TXD PCA82C250 V ref RXD GND 30 pF Test circuit for dynamic characteristics. V TXD 0 diff V RXD t onTXD t onRXD Timing diagram for dynamic characteristics. V RXD hysteresis 0.5 V Hysteresis. Rev. 06 — 26 March 2009 PCA82C250 CAN controller interface ...
Page 8
... NXP Semiconductors Fig 6. Fig 7. Fig 8. PCA82C250_6 Product data sheet RXD Timing diagram for wake-up from Standby. V diff V RXD Timing diagram for bus dominant to RXD LOW TXD CANH PCA82C250 RXD CANL V ref Rs GND R ext The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1” , test pulses and 3b ...
Page 9
... NXP Semiconductors 12. Application information Fig 9. Fig 10. Application with galvanic isolation. PCA82C250_6 Product data sheet P8xC592/P8xCE598 CAN-CONTROLLER CTX0 CRX0 TXD RXD PCA82C250T CAN-TRANSCEIVER CANH CAN BUS 124 LINE Application of the CAN transceiver. SJA1000 CAN-CONTROLLER TX0 TX1 + 390 DD 6N137 0 V 100 nF 390 +5 V TXD ...
Page 10
... NXP Semiconductors Fig 11. Internal pin configuration. PCA82C250_6 Product data sheet TXD RXD 5 V ref Rev. 06 — 26 March 2009 PCA82C250 CAN controller interface 3 7 CANH PCA82C250 CANL 6 2 mka679 GND © NXP B.V. 2009. All rights reserved ...
Page 11
... NXP Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
Page 12
... NXP Semiconductors 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
Page 13
... NXP Semiconductors 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
Page 14
... NXP Semiconductors Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . PCA82C250_6 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature ...
Page 15
... PCA82C250_6 20090326 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • DIP8 package discontinued; bare die no longer available. ...
Page 16
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 17
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Soldering of SMD packages ...