24LC64X-I/ST Microchip Technology, 24LC64X-I/ST Datasheet - Page 20

IC SERIAL EEPROM 64K 2.5V 8TSSOP

24LC64X-I/ST

Manufacturer Part Number
24LC64X-I/ST
Description
IC SERIAL EEPROM 64K 2.5V 8TSSOP
Manufacturer
Microchip Technology
Datasheets

Specifications of 24LC64X-I/ST

Memory Size
64K (8K x 8)
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP (0.173", 4.40mm Width)
Memory Configuration
8K X 8
Ic Interface Type
I2C
Clock Frequency
400kHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
TSSOP
No. Of Pins
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
24LC64X-I/ST
Manufacturer:
MICROCHIP
Quantity:
12 000
24AA64/24LC64/24FC64
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21189L-page 20
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
A1
D2
A3
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
Microchip Technology Drawing C04-123B
D2
2
e
© 2007 Microchip Technology Inc.
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
E2
NOTE 1

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