PC28F256P30B85F NUMONYX, PC28F256P30B85F Datasheet - Page 51
![IC FLASH 256MBIT 85NS 64EZBGA](/photos/7/30/73087/pc28f256p30b85_s_la9e_sml.jpg)
PC28F256P30B85F
Manufacturer Part Number
PC28F256P30B85F
Description
IC FLASH 256MBIT 85NS 64EZBGA
Manufacturer
NUMONYX
Series
StrataFlash™r
Datasheet
1.RD48F4400P0VBQEJ.pdf
(97 pages)
Specifications of PC28F256P30B85F
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
256M (16Mx16)
Speed
85ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 2 V
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
890210
890210
PC28F256P30B85 S LA9E
890210
PC28F256P30B85 S LA9E
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PC28F256P30B85F
Manufacturer:
Micron Technology Inc
Quantity:
10 000
P30
Figure 17: Reset Operation Waveforms
12.3
August 2008
Order Number: 306666-12
(A) Reset during
(B) Reset during
(C) Reset during
(D) VCC Power-up to
read mode
program or block erase
P1 ≤ P2
program or block erase
P1 ≥ P2
RST# high
Power Supply Decoupling
Flash memory devices require careful power supply de-coupling. Three basic power
supply current considerations are 1) standby current levels, 2) active current levels,
and 3) transient peaks produced when CE# and OE# are asserted and deasserted.
When the device is accessed, many internal conditions change. Circuits within the
device enable charge-pumps, and internal logic states change at high speed. All of
these internal activities produce transient signals. Transient current magnitudes depend
on the device outputs’ capacitive and inductive loading. Two-line control and correct
de-coupling capacitor selection suppress transient voltage peaks.
Because Numonyx Multi-Level Cell (MLC) flash memory devices draw their power from
VCC, VPP, and VCCQ, each power connection should have a 0.1 µF ceramic capacitor to
ground. High-frequency, inherently low-inductance capacitors should be placed as close
as possible to package leads.
Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor
should be placed between power and ground close to the devices. The bulk capacitor is
meant to overcome voltage droop caused by PCB trace inductance.
RST# [P]
RST# [P]
RST# [P]
V
CC
V
V
V
V
V
V
V
0V
CC
IH
IH
IH
IL
IL
IL
P1
P2
P2
P3
Complete
Abort
Complete
Abort
R5
R5
Datasheet
R5
51