GRM31CR71H105KA61L Murata, GRM31CR71H105KA61L Datasheet - Page 211

Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1206 1uF 50volts X7R 10%

GRM31CR71H105KA61L

Manufacturer Part Number
GRM31CR71H105KA61L
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1206 1uF 50volts X7R 10%
Manufacturer
Murata
Series
GRMr

Specifications of GRM31CR71H105KA61L

Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
1.6 mm W x 3.2 mm L x 1.6 mm H
Termination Style
SMD/SMT
Capacitance
1 uF
Tolerance
10 %
Package / Case
1206 (3216 metric)
Tolerance (+ Or -)
10%
Voltage
50VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
3.2mm
Product Depth (mm)
1.6mm
Product Height (mm)
1.6mm
Product Diameter (mm)
Not Requiredmm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GRM31CR71H105KA61L
Manufacturer:
SAMSUNG
Quantity:
460 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
3. Land Layout for Cropping PC Board
210
!Caution
[Component Direction]
Caution (Soldering and Mounting)
Do not expose a capacitor to excessive shock or vibration
during use.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
<Example
to be avoided>
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Example
of improvement>
Locate chip
horizontal to the
direction in which
stress acts.
2. Circuit Board Material
[Chip Mounting Close to Board Separation Point]
It is possible for the chip to crack by the expansion and
shrinkage of a metal board.
Please contact us if you want to use our ceramic
capacitors on a metal board such as Aluminum.
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
C02E.pdf
10.12.20

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