GCM188R71H103KA37D Murata, GCM188R71H103KA37D Datasheet - Page 28

• Manufacturer Part Number: GCM188R71H103KA37D
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0603 0.01uF 50volts X7R 10%
• Manufacturer: Murata
• Series: GCMr

Specifications of GCM188R71H103KA37D

• Voltage Rating: 50 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Product: Automotive MLCCs
• Dimensions: 0.8 mm W x 1.6 mm L x 0.8 mm H
• Termination Style: SMD/SMT
• Capacitance: 0.01 uF
• Tolerance: 10 %
• Package / Case: 0603 (1608 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
(1) Notice for Pattern Forms
Pattern Forms
26
Notice
Prohibited
Correct
Notice (Soldering and Mounting)
Unlike leaded components, chip components are
susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal
stresses than leaded components.
Excess solder fillet height can multiply these stresses and
cause chip cracking. When designing substrates, take
land patterns and dimensions into consideration to
eliminate the possibility of excess solder fillet height.
It causes breaking a chip to mount on metal substrate
when heat stress increased, because there are different
of thermal expansion coefficient between metal substrate
and chip. Please contact us in the case of mounting
metal substrate beforehand.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Placing Close to Chassis
Solder
Resist
Electrode Pattern
Solder (Ground)
Chassis
in section
in section
Placing of Chip Components
and Leaded Components
Solder Resist
Lead Wire
in section
in section
Placing of Leaded Components
after Chip Component
Solder Resist
Soldering Iron
Lead Wire
in section
in section
Continued on the following page.
Lateral Mounting
Solder Resist
C03E.pdf
09.3.31