S29AL016J70BFI020 Spansion Inc., S29AL016J70BFI020 Datasheet - Page 55

• Manufacturer Part Number: S29AL016J70BFI020
• Description: IC, FLASH, 16MBIT, 70NS, BGA-48
• Manufacturer: Spansion Inc.

Specifications of S29AL016J70BFI020

• Memory Type: Flash
• Memory Size: 16Mbit
• Memory Configuration: 2M X 8 / 1M X 16
• Ic Interface Type: CFI, Parallel
• Access Time: 70ns
• Supply Voltage Range: 2.7 To 3.6 V
• Memory Case Style: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

20.2
February 18, 2010 S29AL016J_00_10
VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
ME
A1
A2
D1
E1
φb
D
N
A
E
e
A1
0.18
0.62
0.35
MIN
8.15 mm x 6.15 mm NOM
---
INDEX MARK
10
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
48
---
---
---
---
---
8
6
SEATING PLANE
D a t a
TOP VIEW
SIDE VIEW
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S29AL016J
NOTE
A
0.10
A2
C
(4X)
E
B
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
6
C
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φb
φ 0.08
φ 0.15
H
M
M
C
C
G
A
BOTTOM VIEW
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
3338 \ 16-038.25b
A1 CORNER
SE
7
E1
55