S29AL032D90TFI000 Spansion Inc., S29AL032D90TFI000 Datasheet - Page 7

• Manufacturer Part Number: S29AL032D90TFI000
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL032D90TFI000

• Memory Size: 32Mbit
• Memory Configuration: 4M X 8
• Ic Interface Type: CFI, Parallel
• Access Time: 90ns
• Supply Voltage Range: 2.7 To 3.6 V
• Memory Case Style: TSOP
• No. Of Pins: 40
• Memory Type: Uniform Sector Flash
• Interface Type: CFI
• Rohs Compliant: Yes
• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 90ns
• Boot Type: Top
• Address Bus: 22/21Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 4M/2M
• Supply Current: 35mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

4.
4.1
July 18, 2007 S29AL032D_KGD_SP_02
Ordering Information
Valid Combinations
Spansion standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local
Spansion sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Device Number
S29AL032D
S29AL032D
90
Speed Option
W
90
S u p p l e m e n t
H
S29AL032D Known Good Die
E
Package Type, and Temperature Range
01
S29AL032D Valid Combinations
4
WGI, WGV
WHI, WHV,
WEI, WEV
DEVICE CARRIER
4 = Die in Surftape™ (Tape and Reel)
7 = Die in Waffle Pack
9 = Wafer in Wafer Jar
MODEL NUMBER
03 = V
04 = V
TEMPERATURE RANGE
I
V = Automotive, In Cabin (–40°C to +105°C)
DIE/WAFER OPTION
H = 280 µm thickness without polyimide
G = 500 µm thickness without polyimide
E = 725 µm thickness without polyimide
PACKAGE TYPE
D = Die with KGD test flow
W = Wafer with KGD test flow
SPEED OPTION
90 = 90 ns Access Speed
DEVICE NUMBER/DESCRIPTION
S29AL032D
32 Megabit Flash Memory manufactured using 200 nm process technology
3.0 Volt-only Read, Program, and Erase
= Industrial (–40°C to + 85°C)
2500 per 7 inch reel
140 die per 5 tray stack
CC
CC
= 2.7 - 3.6V, top boot sector device
= 2.7 - 3.6V, bottom boot sector device
Model Number
03, 04
Device Carrier
9
7