PIC24FJ256GB106-I/MR Microchip Technology, PIC24FJ256GB106-I/MR Datasheet - Page 318

• Manufacturer Part Number: PIC24FJ256GB106-I/MR
• Description: IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ256GB106-I/MR

• Controller Family/series: PIC24
• No. Of I/o's: 51
• Ram Memory Size: 16KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Core Size: 16 Bit
• Program Memory Size: 256KB
• Peripherals: ADC, Comparator, PWM, RTC, Timer
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Number Of I /o: 51
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN, Exposed Pad
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24FJ256GB110 FAMILY
TABLE 29-7:
DS39897C-page 318
DC CHARACTERISTICS
DI10
DI11
DI15
DI16
DI17
DI18
DI19
DI20
DI21
DI25
DI26
DI27
DI28
DI29
DI30
DI30A I
DI50
DI51
DI52
DI55
DI56
Note 1:
Param
No.
2:
3:
4:
V
V
I
I
CNPU
CNPD
IL
Sym
IL
IH
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
Refer to Table 1-4 for I/O pins buffer types.
Input Low Voltage
I/O Pins with ST Buffer
I/O Pins with TTL Buffer
MCLR
OSC1 (XT mode)
OSC1 (HS mode)
I/O Pins with I
I/O Pins with SMBus Buffer:
Input High Voltage
I/O Pins with ST Buffer:
I/O Pins with TTL Buffer:
MCLR
OSC1 (XT mode)
OSC1 (HS mode)
I/O Pins with I
I/O Pins with SMBus Buffer:
CNxx Pull-up Current
CNxx Pull-Down Current
Input Leakage Current
I/O Ports
Analog Input Pins
USB Differential Pins
(D+, D-)
MCLR
OSC1
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
with Analog Functions,
Digital Only
with Analog Functions,
Digital Only
with Analog Functions,
Digital Only
with Analog Functions,
Digital Only
Characteristic
2
2
C™ Buffer:
C Buffer:
(4)
(4)
(2,3)
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise
stated)
Operating temperature
0.25 V
0.25 V
0.8 V
0.8 V
0.8 V
0.7 V
0.7 V
0.7 V
0.7 V
Min
V
V
V
V
V
V
V
2.1
2.1
50
—
—
—
—
—
—
DD
DD
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
+ 0.8
+ 0.8
Typ
250
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
80
—
—
—
—
—
(1)
0.15 V
0.2 V
0.2 V
0.2 V
0.2 V
0.3 V
-40°C  T
Max
V
V
V
V
V
V
V
400
0.8
5.5
5.5
5.5
5.5
+1
+1
+1
+1
+1
—
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
A
Units
 +85°C for Industrial
A
A
A
A
A
A
A
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
 2009 Microchip Technology Inc.
SMBus enabled
2.5V  V
V
V
V
Pin at high-impedance
V
Pin at high-impedance
V
V
V
XT and HS modes
DD
DD
SS
SS
USB
SS
SS
 V
 V
 V
 V
= 3.3V, V
= 3.3V, V
 V
Conditions
PIN
PIN
PIN
PIN
PIN
DD
 V
 V
 V
V
 V
PIN
PIN
DD
DD
DD
DD
DD
= V
= V
,
,
,
SS
DD