LT3060HTS8-2.5#PBF Linear Technology, LT3060HTS8-2.5#PBF Datasheet - Page 23
![IC, LDO REG, 2.5 V, 8TSOT](/photos/19/1/190152/4243431_sml.jpg)
LT3060HTS8-2.5#PBF
Manufacturer Part Number
LT3060HTS8-2.5#PBF
Description
IC, LDO REG, 2.5 V, 8TSOT
Manufacturer
Linear Technology
Datasheet
1.LT3060EDCTRMPBF.pdf
(26 pages)
Specifications of LT3060HTS8-2.5#PBF
Primary Input Voltage
3.05V
Output Voltage Fixed
2.5V
Dropout Voltage Vdo
300mV
No. Of Pins
8
Output Current
100mA
Operating Temperature Range
-40°C To +150°C
Peak Reflow Compatible (260 C)
Yes
Msl
MSL 1 - Unlimited
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
package DescripTion
2.55 ±0.05
1.15 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
0.64 ±0.05
(2 SIDES)
0.200 REF
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
1.37 ±0.05
(Reference LTC DWG # 05-08-1719 Rev A)
(2 SIDES)
8-Lead Plastic DFN (2mm × 2mm)
0.45 BSC
0.75 ±0.05
DC Package
0.70 ±0.05
0.25 ± 0.05
2.00 ±0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
R = 0.05
0.64 ± 0.10
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
4
TYP
5
1.37 ±0.10
(2 SIDES)
8
0.45 BSC
1
0.40 ± 0.10
(DC8) DFN 0409 REVA
0.23 ± 0.05
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
LT3060 Series
23
3060fa