DSPIC30F1010T-30I/SO Microchip Technology, DSPIC30F1010T-30I/SO Datasheet - Page 24
DSPIC30F1010T-30I/SO
Manufacturer Part Number
DSPIC30F1010T-30I/SO
Description
6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in T
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F1010T-30I/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Data Bus Width
16 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
21
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCK
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
DSPIC30F1010T-30I/SOTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F1010T-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- AC164335 PDF datasheet
- DM300023 PDF datasheet #2
- DM300023 PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20IP PDF datasheet #5
- DSPIC30F1010-30ISO PDF datasheet #6
- DSPIC30F1010-30ISO PDF datasheet #7
- Current page: 24 of 286
- Download datasheet (5Mb)
dsPIC30F1010/202X
2.3
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and 16/
16-bit signed and unsigned integer divide operations, in
the form of single instruction iterative divides. The
following instructions and data sizes are supported:
1.
2.
3.
4.
5.
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
DS70178C-page 22
DIVF
DIV.sd
DIV.ud
DIV.sw
DIV.uw
DIVF – 16/16 signed fractional divide
DIV.sd – 32/16 signed divide
DIV.ud – 32/16 unsigned divide
DIV.sw – 16/16 signed divide
DIV.uw – 16/16 unsigned divide
Divide Support
Instruction
DIVIDE INSTRUCTIONS
Signed fractional divide: Wm/Wn
Signed divide: (Wm + 1:Wm)/Wn
Unsigned divide: (Wm + 1:Wm)/Wn
Signed divide: Wm / Wn
Unsigned divide: Wm / Wn
Preliminary
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g. a series
of discrete divide instructions) will not function correctly
because the instruction flow depends on RCOUNT.
The divide instruction does not automatically set up the
RCOUNT value, and it must, therefore, be explicitly
and correctly specified in the REPEAT instruction, as
shown in Table 2-1 (REPEAT will execute the target
instruction {operand value + 1} times). The REPEAT
loop count must be set up for 18 iterations of the DIV/
DIVF instruction. Thus, a complete divide operation
requires 19 cycles.
Note:
W0; Rem
W0; Rem
Function
The Divide flow is interruptible. However,
the user needs to save the context as
appropriate.
W0; Rem
W0; Rem
W0; Rem
W1
W1
© 2006 Microchip Technology Inc.
W1
W1
W1
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