DSPIC30F2011T-20E/SO Microchip Technology, DSPIC30F2011T-20E/SO Datasheet - Page 209
![IC,DSP,16-BIT,CMOS,SOP,18PIN,PLASTIC](/photos/6/76/67656/150-18-soic_sml.jpg)
DSPIC30F2011T-20E/SO
Manufacturer Part Number
DSPIC30F2011T-20E/SO
Description
IC,DSP,16-BIT,CMOS,SOP,18PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20IP.pdf
(26 pages)
Specifications of DSPIC30F2011T-20E/SO
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOIC
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F2011-20ISO PDF datasheet #3
- DSPIC30F2011-20ISO PDF datasheet #4
- DSPIC30F2011-20ISO PDF datasheet #5
- DSPIC30F2011-20IP PDF datasheet #6
- Current page: 209 of 210
- Download datasheet (3Mb)
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2010 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F3013AT-30I/SP = 30 MIPS, Industrial temp., SPDIP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 3 0 1 3 AT- 3 0 I / S P - E S
dsPIC30F2011/2012/3012/3013
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
P
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
MM = QFN-S (6x6)
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= DIP
T = Tape and Reel
DS70139G-page 209
Speed
20 = 20 MIPS
30 = 30 MIPS
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