LM10CWM National Semiconductor, LM10CWM Datasheet - Page 2

• Manufacturer Part Number: LM10CWM
• Description: Operational Amplifier (Op-Amp) IC
• Manufacturer: National Semiconductor

Specifications of LM10CWM

• No. Of Amplifiers: 1
• Slew Rate: 0.2V/µs
• No. Of Pins: 14
• Mounting Type: Surface Mount
• Peak Reflow Compatible (260 C): No
• Input Bias Current: 30nA
• Supply Voltage: 48V
• Output Current: 20mA
• Input Offset Voltage Max: 4mV
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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Input offset voltage
Input offset current
(Note 6)
Input bias current
Input resistance
Large signal voltage
gain
Shunt gain (Note 7)
Common-mode
rejection
Supply-voltage
rejection
Offset voltage drift
Offset current drift
Bias current drift
Absolute Maximum Ratings
8)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
T
Total Supply Voltage
Differential Input Voltage (Note 2)
Power Dissipation (Note 3)
Output Short-circuit Duration (Note
4)
Storage-Temp. Range
Lead Temp. (Soldering, 10 seconds)
Lead Temp. (Soldering, 10
seconds) DIP
J
=25˚C, T
Metal Can
Vapor Phase (60 seconds)
Infrared (15 seconds)
Parameter
MIN
≤T
J
≤T
MAX
V
V
V
I
V
V
1.2V (1.3V) ≤V
R
0.1 mA≤I
1.5V≤V
0.1 mA≤I
−20V≤V
V
−0.2V≥V
V
1.0V (1.1V) ≤V
V
T
OUT
C
S
OUT
S
S
OUT
S
+
−
L
(Boldface type refers to limits over temperature range) (Note 5)
=1.1 kΩ
=1.0V (1.1V)
=−0.2V
=
=
=
=
<
±
±
±
±
=
100˚C
=
=
20V, I
20V, V
0.6V (0.65V), I
20V
±
±
±
20 mA (
+
CM
19.95V
0.4V (
≤40V, R
−
OUT
OUT
≥−39V
≤19.15V (19V)
OUT
Conditions
OUT
LM10/LM10B/LM10BL/
≤5 mA
≤20 mA
±
OUT
+
=0
±
0.3V), V
≤39.8V
=
L
15 mA)
−55˚C to +150˚C
LM10C
internally limited
±
=250Ω
±
≤40V,
45V
19.4V
40V
continuous
OUT
300˚C
260˚C
215˚C
220˚C
=
CM
(Notes 1,
±
=−0.4V
2 mA
LM10CL
±
7V
7V
Min
250
150
120
2
1.5
0.5
80
50
20
14
93
87
90
84
96
90
6
8
4
See AN-450 “Surface Mounting Methods and Their Effect on
Product Reliability” for other methods of soldering surface
mount devices.
ESD rating is to be determined.
Operating Ratings
Maximum Junction Temperature
Package Thermal Resistance
LM10/LM10B
LM10
LM10B
LM10C
θ
θ
JA
JC
0.25
Typ
H Package
N Package
WM Package
H Package
500
400
130
102
106
0.3
3.0
2.0
2.0
10
33
25
96
60
Max
2.0
3.0
0.7
1.5
20
30
0.75
Min
150
115
1.0
80
50
25
15
10
90
87
87
84
93
90
6
6
4
LM10C
Typ
400
400
130
102
106
0.5
0.4
3.0
5.0
5.0
12
33
25
96
90
Max
4.0
5.0
2.0
3.0
30
40
150˚C/W
87˚C/W
90˚C/W
45˚C/W
150˚C
100˚C
85˚C
Units
V/mV
V/mV
V/mV
V/mV
V/mV
V/mV
V/mV
V/mV
V/mV
V/mV
µV/˚C
pA/˚C
pA/˚C
mV
mV
nA
nA
nA
nA
kΩ
kΩ
dB
dB
dB
dB
dB
dB