LM567CN National Semiconductor, LM567CN Datasheet - Page 9
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LM567CN
Manufacturer Part Number
LM567CN
Description
IC,PHASE-LOCKED LOOP,BIPOLAR,DIP,8PIN,PLASTIC
Manufacturer
National Semiconductor
Datasheet
1.LM567CN.pdf
(12 pages)
Specifications of LM567CN
Rohs Compliant
NO
Operating Frequency (max)
500kHz
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
9V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Package Type
MDIP
Mounting
Through Hole
Pin Count
8
Supply Current
12mA
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM567CN
Manufacturer:
NS/国半
Quantity:
20 000
Company:
Part Number:
LM567CN/NOPB
Manufacturer:
AD
Quantity:
137
LM567C MDC MWC
TONE DECODER
DIE/WAFER CHARACTERISTICS
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
SIGNAL NAME
OUTPUT
FILTER
LOOP FILTER
INPUT
V+
TIMING RES
TIMING CAP
GND
OUTPUT
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
Fabrication Attributes
Physical Attributes
1
2
3
4
5
6
7
8
Die Bond Pad Coordinate Locations (C - Step)
-673
-673
-673
-356
-318
673
673
178
LM567C
C
150mm
1600µm x 1626µm
63.0mils x 64.0mils
406µm Nominal
198µm Nominal
X/Y COORDINATES
X
Die Layout (C - Step)
9
-419
-686
-686
-122
686
686
679
76
Y
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
00697523
117
117
General Die Information
91
91
91
91
91
91
X
PAD SIZE
x
x
x
x
x
x
x
x
91µm x 91µm
0.5% COPPER_BAL.
ALUMINUM
VOM NITRIDE
BARE BACK
Floating
www.national.com
104
91
91
91
91
91
91
91
Y