LMV112SD National Semiconductor, LMV112SD Datasheet - Page 4

IC,Dual Clock Driver,CMOS,LLCC,8PIN,PLASTIC

LMV112SD

Manufacturer Part Number
LMV112SD
Description
IC,Dual Clock Driver,CMOS,LLCC,8PIN,PLASTIC
Manufacturer
National Semiconductor
Datasheet

Specifications of LMV112SD

Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
LMV112SD
Manufacturer:
NS/国半
Quantity:
20 000
Part Number:
LMV112SD/NOPB
Manufacturer:
TI
Quantity:
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Miscellaneous Performance
R
C
Z
V
I
V
V
SC
Symbol
IN
5V Electrical Characteristics
O
en_hmin
en_lmax
IN
IN
Unless otherwise specified, all limits are guaranteed for T
pF, R
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics Tables.
Note 2: Human Body Model: 1.5 kΩ in series with 100 pF. Machine Model: 0Ω in series with 200 pF.
Note 3: The maximum power dissipation is a function of T
P
Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
T
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Slew rate is the average of the positive and negative slew rate.
Note 8: Average Temperature Coefficient is determined by dividing the changing in a parameter at temperature extremes by the total temperature change.
Note 9: Short−Circuit test is a momentary test. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed
junction temperature of 150˚C.
J
D
>
= (T
T
A
L
J(MAX)
.
= 30 kΩ, C
Input Resistance per Buffer
Input Capacitance per Buffer
Input Impedance
Output Swing Positive
Output Swing Negative
Output Short-Circuit Current
(Note 9)
Enable High Active Minimum
Voltage
Enable Low Inactive Maximum
Voltage
− T
A
) / θ
J
JA
COUPLING
= T
. All numbers apply for packages soldered directly onto a PC board.
A
Parameter
. There is no guarantee of parametric performance as indicated in the electrical tables under conditions of internal self-heating where
= 1 nF. Boldface limits apply at temperature range extremes of operating condition. See (Note 4)
Enable = V
Enable = V
Enable = V
Enable = V
f = 26 MHz, Enable = V
f = 26 MHz, Enable = V
V
V
Sourcing
Sinking
J(MAX)
IN
IN
(Continued)
= V
= V
, θ
DD
SS
JA
J
, and T
DD
SS
DD
SS
= 25˚C, V
Conditions
4
A
. The maximum allowable power dissipation at any ambient temperature is
DD
DD
SS
= 5V, V
SS
= 0V, V
(Note 6)
4.96
4.94
Min
-40
-28
70
50
CM
= 1V, Enable
(Note 5)
4.99
Typ
134
134
-68
2.0
2.0
7.2
8.0
1.2
0.6
10
98
1,2
(Note 6)
= V
Max
40
55
DD
, C
L
Units
= 20
mV
mA
kΩ
kΩ
pF
V
V

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