PIC12F509T-I/MC Microchip Technology, PIC12F509T-I/MC Datasheet - Page 109

• Manufacturer Part Number: PIC12F509T-I/MC
• Description: 1.5 KB Flash, 41 RAM, 6 I/O 8 DFN 2X3mm T/R
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F509T-I/MC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: FLASH
• Ram Size: 41 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
Note:
PART NO.
Device
Tape and Reel available for only the following packages: SOIC, MSOP
and TSSOP.
Temperature
PIC16F505
PIC12F508
PIC12F509
PIC16F505T
PIC12F508T
PIC12F509T
I
E
MC
MS
P
SL
SN
ST
MG
Special Requirements
Range
=
=
X
=
=
=
=
=
=
=
-40°C to +85°C (Industrial)
-40°C to +125°C (Extended)
(1)
(2)
(2)
8L DFN 2x3 (DUAL Flatpack No-Leads)
Micro-Small Outline Package (MSOP)
Plastic (PDIP)
14L Small Outline, 3.90 mm (SOIC)
8L Small Outline, 3.90 mm Narrow (SOIC)
Thin Shrink Small Outline (TSSOP)
16L QFN (3x3x0.9)
Package
/XX
(4)
(5)
Pattern
XXX
(4)
(4)
PIC12F508/509/16F505
(3, 4)
(3, 4)
(4)
Note 1:
Examples:
a)
b)
c)
2:
3:
4:
5:
PIC12F508-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC12F508-I/SN = Industrial Temp., SOIC
package
PIC12F508T-E/P = Extended Temp., PDIP
package, Tape and Reel
T
T
PIC12F508/PIC12F509 only.
Pb-free.
PIC16F505 only.
= in tape and reel SOIC, TSSOP and
= in tape and reel SOIC and MSOP
QFN packages only
packages only.
.
DS41236E-page 109