PIC12F609-E/P Microchip Technology, PIC12F609-E/P Datasheet - Page 153
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PIC12F609-E/P
Manufacturer Part Number
PIC12F609-E/P
Description
1.75KB Flash, 64B RAM, 6 I/O, 8MHz Internal Oscillator 8 PDIP .300in TUBE
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(8 pages)
3.PIC12F609T-ISN.pdf
(26 pages)
4.PIC12F609T-ISN.pdf
(8 pages)
Specifications of PIC12F609-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232 , USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
2
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F609-E/P
Manufacturer:
Microchip Technology
Quantity:
135
16.8
2010 Microchip Technology Inc.
DC CHARACTERISTICS
D101*
D101A* C
D130
D130A
D131
D132
D132A
D133
D134
Note 1:
Param
No.
2:
3:
4:
5:
6:
*
†
COSC2
E
E
V
V
V
T
T
DC Characteristics:
RETD
PEW
IO
P
D
PR
PEW
PEW
Sym
These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
Negative current is defined as current sourced by the pin.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled.
This specification applies to all weak pull-up pins, including the weak pull-up found on GP3/MCLR. When GP3/MCLR is
configured as MCLR reset pin, the weak pull-up is always enabled.
Applies to PIC12F617 only.
Capacitive Loading Specs on
Output Pins
OSC2 pin
All I/O pins
Program Flash Memory
Cell Endurance
Cell Endurance
V
V
V
Erase/Write cycle time
Characteristic Retention
DD
DD
DD
for Read
for Bulk Erase/Write
for Row Erase/Write
Characteristic
PIC12F609/615/617/12HV609/615
PIC12F609/615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended) (Continued)
(6)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
V
Min
10K
4.5
1K
40
—
—
—
MIN
MIN
100K
Typ†
10K
—
—
—
—
—
—
2
-40°C T
-40°C T
Max
5.5
5.5
5.5
2.5
15
50
—
—
—
Units
A
A
Year Provided no other specifications
E/W -40°C T
E/W +85°C T
ms
pF
pF
+85°C for industrial
+125°C for extended
V
V
V
In XT, HS and LP modes when
external clock is used to drive
OSC1
V
voltage
are violated
MIN
= Minimum operating
A
A
Conditions
+85°C
+125°C
DS41302D-page 153