PIC16F819-E/ML Microchip Technology, PIC16F819-E/ML Datasheet - Page 277

• Manufacturer Part Number: PIC16F819-E/ML
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,28PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F819-E/ML

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28QFN3 - SOCKET TRAN ICE 18DIP/28QFNAC164033 - ADAPTER 28QFN TO 18DIPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Lead Free Status / Rohs Status: Details

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C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 17. Master Synchronous Serial Port (MSSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
17.1 Introduction ..................................................................................................................17-2
17.2 Control Register ...........................................................................................................17-4
17.3 SPI Mode .....................................................................................................................17-9
17.4 SSP I
17.5 Connection Considerations for I
17.6 Initialization ................................................................................................................17-57
17.7 Design Tips ................................................................................................................17-58
17.8 Related Application Notes..........................................................................................17-59
17.9 Revision History .........................................................................................................17-60
Note:
At present NO Mid-Range MCU devices are available with this module. Devices are
planned, but there is no schedule for availability. Please refer to Microchip’s Web site
or BBS for release of Product Briefs. You will be able to find out the details and the
features for new devices.
This module is available on Microchip’s High End family (PIC17CXXX). Please
refer to Microchip’s Web site, BBS, Regional Sales Office, or Factory Repre-
sentatives.
2
C™ Operation .................................................................................................17-18
Preliminary
2
C Bus .....................................................................17-56
DS31017A page 17-1
17