PIC24FJ64GA006T-I/PT Microchip Technology, PIC24FJ64GA006T-I/PT Datasheet - Page 229

• Manufacturer Part Number: PIC24FJ64GA006T-I/PT
• Description: Microcontroller
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ64GA006T-I/PT

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TFQFP
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DV164033, MA240013, AC164127, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM240011 - KIT STARTER MPLAB FOR PIC24F MCUDV164033 - KIT START EXPLORER 16 MPLAB ICD2MA160011 - DAUGHTER BOARD PICDEM LCD 16F91XDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

© 2009 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
PIC24FJ128GA010 FAMILY
NOTE 2
E1
φ
L
Units
A2
A1
L1
E1
D1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS39747E-page 229
A2
α