S29AL016D70TFI020 Spansion Inc., S29AL016D70TFI020 Datasheet - Page 4
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S29AL016D70TFI020
Manufacturer Part Number
S29AL016D70TFI020
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Datasheet
1.S29AL016D70TFI020.pdf
(58 pages)
Specifications of S29AL016D70TFI020
Memory Size
16Mbit
Memory Configuration
2M X 8 / 1M X 16
Ic Interface Type
Parallel
Access Time
70ns
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S29AL016D70TFI020
Manufacturer:
SPANSION
Quantity:
101
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Manufacturer:
SPANSION
Quantity:
1 200
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Manufacturer:
SPANSION
Quantity:
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Part Number:
S29AL016D70TFI020
Manufacturer:
SPANSION
Quantity:
20 000
Part Number:
S29AL016D70TFI020E
Manufacturer:
SPANSION
Quantity:
20 000
Company:
Part Number:
S29AL016D70TFI020H
Manufacturer:
SPANSION
Quantity:
1 520
Part Number:
S29AL016D70TFI020H
Manufacturer:
SPANSION
Quantity:
20 000
Table of Contents
General Description . . . . . . . . . . . . . . . . . . . . . . . . 2
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
Common Flash Memory Interface (CFI) . . . . . . . 18
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 22
Write Operation Status . . . . . . . . . . . . . . . . . . . . 29
4
Special Handling Instructions ...............................................................7
S29AL016D Standard Products ........................................................... 9
Word/Byte Configuration ...................................................................10
Requirements for Reading Array Data ............................................ 11
Writing Commands/Command Sequences .................................... 11
Program and Erase Operation Status ............................................... 11
Standby Mode ......................................................................................... 12
Automatic Sleep Mode ......................................................................... 12
RESET#: Hardware Reset Pin ............................................................ 12
Output Disable Mode ........................................................................... 13
Autoselect Mode ................................................................................... 14
Sector Protection/Unprotection ....................................................... 15
Temporary Sector Unprotect ........................................................... 15
Hardware Data Protection ................................................................20
Low V
Write Pulse “Glitch” Protection ......................................................20
Logical Inhibit .......................................................................................... 21
Power-Up Write Inhibit ...................................................................... 21
Reading Array Data ............................................................................. 22
Reset Command ................................................................................... 22
Autoselect Command Sequence ...................................................... 23
Word/Byte Program Command Sequence ................................... 23
Unlock Bypass Command Sequence ............................................... 24
Chip Erase Command Sequence ...................................................... 25
Sector Erase Command Sequence .................................................. 25
Erase Suspend/Erase Resume Commands .................................... 26
Command Definitions ......................................................................... 28
DQ7: Data# Polling .............................................................................. 29
RY/BY#: Ready/Busy# ......................................................................... 30
DQ6: Toggle Bit I ................................................................................... 31
Table 1. S29AL016D Device Bus Operations .........................10
Table 2. Sector Address Tables (Top Boot Device) .................13
Table 3. Sector Address Tables (Bottom Boot Device) ............14
Table 4. S29AL016D Autoselect Codes (High Voltage Method) .15
Figure 1. Temporary Sector Unprotect Operation................... 16
Figure 2. In-System Sector Protect/Unprotect Algorithms ....... 17
Table 5. CFI Query Identification String ...............................18
Table 6. System Interface String .........................................19
Table 7. Device Geometry Definition ....................................19
Table 8. Primary Vendor-Specific Extended Query .................20
Figure 3. Program Operation .............................................. 24
Figure 4. Erase Operation .................................................. 27
Table 9. S29AL016D Command Definitions ...........................28
Figure 5. Data# Polling Algorithm ....................................... 30
CC
Write Inhibit .......................................................................20
S29AL016D
P r e l i m i n a r y
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 35
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . 36
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 41
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 46
Erase and Programming Performance . . . . . . . . 53
TSOP and BGA Pin Capacitance . . . . . . . . . . . . . 53
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . 54
SO044—44-Pin Small Outline Package (SOP)
28.20 mm x 13.30 mm . . . . . . . . . . . . . . . . . . . . . . . 57
Revision Summary. . . . . . . . . . . . . . . . . . . . . . . . . 58
DQ2: Toggle Bit II ................................................................................ 32
Reading Toggle Bits DQ6/DQ2 ........................................................ 32
DQ5: Exceeded Timing Limits ...........................................................33
DQ3: Sector Erase Timer .................................................................. 34
Industrial (I) Devices ............................................................................ 36
V
CMOS Compatible ................................................................................37
Zero Power Flash ................................................................................. 38
Key to Switching Waveforms ...........................................................40
Read Operations .................................................................................... 41
Hardware Reset (RESET#) ................................................................ 42
Word/Byte Configuration (BYTE#) ................................................ 43
Erase/Program Operations ................................................................ 45
Temporary Sector Unprotect .......................................................... 49
Alternate CE# Controlled Erase/Program Operations ............. 51
TS 048—48-Pin Standard TSOP ...................................................... 54
VBK048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
8.15 mm x 6.15 mm ................................................................................ 56
Revision A (May 4, 2004) ................................................................... 58
Revision A1 (July 28, 2004) ................................................................. 58
Revision A2 (December 17, 2004) ................................................... 58
CC
Figure 6. Toggle Bit Algorithm ............................................ 33
Table 10. Write Operation Status ....................................... 34
Figure 7. Maximum Negative Overshoot Waveform................ 35
Figure 8. Maximum Positive Overshoot Waveform ................. 35
Figure 9. I
Automatic Sleep Currents) ................................................. 38
Figure 10. Typical I
Figure 11. Test Setup ........................................................ 39
Table 11. Test Specifications ............................................. 39
Figure 12. Input Waveforms and Measurement Levels............ 40
Figure 13. Read Operations Timings .................................... 41
Figure 14. RESET# Timings ................................................ 42
Figure 15. BYTE# Timings for Read Operations ..................... 43
Figure 16. BYTE# Timings for Write Operations..................... 44
Figure 17. Program Operation Timings ................................. 46
Figure 18. Chip/Sector Erase Operation Timings.................... 47
Figure 19. Data# Polling Timings (During Embedded
Algorithms)...................................................................... 48
Figure 20. Toggle Bit Timings (During Embedded Algorithms) . 48
Figure 21. DQ2 vs. DQ6 for Erase and Erase Suspend
Operations ....................................................................... 49
Figure 22. Temporary Sector Unprotect/Timing Diagram ........ 49
Figure 23. Sector Protect/Unprotect Timing Diagram.............. 50
Figure 24. Alternate CE# Controlled Write Operation Timings.. 52
Supply Voltages ............................................................................ 36
CC1
Current vs. Time (Showing Active and
CC1
vs. Frequency .................................. 38
S29AL016D_00_A2 December 17, 2004