S29AL016D90TFI020 Spansion Inc., S29AL016D90TFI020 Datasheet - Page 9

• Manufacturer Part Number: S29AL016D90TFI020
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL016D90TFI020

• Memory Size: 16Mbit
• Ic Interface Type: Parallel
• Access Time: 90ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Peak Reflow Compatible (260 C): Yes
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
S29AL016D Standard Products
Notes:
1.
2.
3.
December 17, 2004 S29AL016D_00_A2
S29AL016D
S29AL016D
Type 0 is standard. Specify other options as required.
TSOP and SOP package markings omit packing type designator from ordering part number.
BGA package marking omits leading “S29” and packing type designator from ordering part number.
Number
Device
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
Valid Combinations list configurations planned to be supported in volume for this device. Consult your
local sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
70
Option
Speed
70, 90
DEVICE NUMBER/DESCRIPTION
S29AL016D
16 Megabit Flash Memory manufactured using 200 nm process technology
3.0 Volt-only Read, Program, and Erase
T
S29AL016D Valid Combinations
A
Temperature Range
Package Type,
I
Material, and
MAI, MFI
BAI, BFI
P r e l i m i n a r y
TAI, TFI
01
0
PACKING TYPE
0
3
MODEL NUMBER
01
02
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
B
M
SPEED OPTION
70
90
Valid Combinations
S29AL016D
= Tray
= 13” Tape and Reel
= V
= V
= Industrial (–40
= Standard
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fine-pitch Ball-Grid Array Package
= Small Outline Package (SOP) Standard Pinout
= 70 ns Access Speed
= 90 ns Access Speed
Number
Model
01, 02
CC
CC
= 2.7 - 3.6V, top boot sector device
= 2.7 - 3.6V, bottom boot sector device
Packing
(Note
0, 2, 3
Type
°
C to +85
1)
°
C)
VBK048
SO044
TS048
(Note
(Note
(Note
Description
2)
2)
3)
Package
Fine-Pitch BGA
TSOP
SOP
9