G3VM-61LR Omron, G3VM-61LR Datasheet - Page 3
![SSR, MOSFET, 60V, 400mA](/photos/9/55/95577/39-4-ssop-smd_sml.jpg)
G3VM-61LR
Manufacturer Part Number
G3VM-61LR
Description
SSR, MOSFET, 60V, 400mA
Manufacturer
Omron
Series
G3VMr
Datasheets
1.G3VM-2FL.pdf
(6 pages)
2.G3VM-2FL.pdf
(4 pages)
3.G3VM-61LR.pdf
(4 pages)
4.G3VM-61LR.pdf
(2 pages)
Specifications of G3VM-61LR
Load Voltage Max
60VAC
Load Current
400mA
On State Resistance Max
1ohm
Contact Configuration
SPST-NO
Isolation Voltage
1500Vrms
Forward Current If
10mA
Relay Terminals
SMD Inside L
No. Of Pins
4
Circuit
SPST-NO (1 Form A)
Output Type
AC, DC
On-state Resistance
1.5 Ohm
Voltage - Input
1.15VDC
Voltage - Load
0 ~ 60 V
Mounting Type
Surface Mount
Termination Style
Gull Wing
Package / Case
4-SSOP
Control Voltage Range
1 V to 1.3 V
Load Voltage Rating
60 V
Off State Leakage Current (max)
1 uA
Load Current Rating
400 mA
Contact Form
1 Form A
Output Device
MOSFET
Mounting Style
SMD/SMT
Relay Type
MOSFET Relay
Turn-on Switching
FET
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
G3VM-61LR
G3VM61LR
Q2982150
Z2715
G3VM61LR
Q2982150
Z2715
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
G3VM-61LR
Manufacturer:
SST
Quantity:
14 000
■ Protection from Spike Voltage on the
If a spike voltage exceeding the absolute maximum rated value is
generated between the output terminals, insert a C-R snubber or
clamping diode in parallel to the load as shown in the following circuit
diagram to limit the spike voltage.
■ Unused Terminals (6-pin models only)
Terminal 3 is connected to the internal circuit. Do not connect any-
thing to terminal 3 externally.
■ Pin Strength for Automatic Mounting
In order to maintain the characteristics of the relay, the force imposed
on any pin of the relay for automatic mounting must not exceed the
following.
In direction A: 1.96 N
In direction B: 1.96 N
Guidelines for Mounting Devices on PCBs
■ Cleaning
When ions in the flux enter into the product during soldering, fluctua-
tion in device performance or corrosion may occur. Be sure to wash
away any flux residue which contains Cl or Na ions.
The following types of solvents are recommended for cleaning the
flux:
• Asahi Clean AK-225AES
• Kao Cleanthru 750H
• Pine-Alpha ST-100S
Cleaning Conditions
Cleaning conditions and precautions may vary according to product
specifications.
General precautions for dip cleaning
Dipping time varies according to the solvent used.
However, as a general guideline, it is recommended that the dip
time be limited to three minutes.
General precautions for ultrasonic cleaning
When ultrasonic cleaning is conducted for an excessively long
time, contact between the product resin and the metal leads may
lessen. Also, excessive ultrasonic stress may cause cracks in the
pellet.
It is recommended that the applied stress be minimized.
Output Terminals
Spike Voltage Protection Circuit Example
MOS FET Relays
■ Load Connection
Do not short-circuit the input and output terminals while the relay is
operating or the relay may malfunction.
Recommended conditions for standard ultrasonic cleaning
Temperature: 50°C (may vary according to the type of solvent used)
Cleaning must be conducted with the printed circuit board or device
floating on the solvent, so as to avoid direct contact between the PCB
or device and the ultrasonic vibrator.
Handling Precautions
Do not touch the device’s mark-bearing surface with your hand or
with a brush while cleaning or applying cleaning liquid to the device.
This may erase device markings. It is important to confirm that nei-
ther the solvent used for cleaning nor the cleaning conditions will
damage the device package.
Frequency:
Output:
Time:
AC Connection
DC Single Connection
DC Parallel Connection
Technical Information
+
−
+
−
+
−
+
−
27kHz to 29kHz
0.25 W/cm
30 seconds or less
1
2
3
1
2
3
1
2
3
1
2
3
2
or less
6
5
4
6
5
4
6
5
4
6
5
4
Load
Load
Load
Load
AC
Or:
+
−
−
+
+
−
DC
DC
DC
+
−
DC
Or:
−
+
DC
3