L17SM209S114T Amphenol Commercial Products, L17SM209S114T Datasheet
L17SM209S114T
Manufacturer Part Number
L17SM209S114T
Description
CONN D-SUB 9POS GROUNDING TAB
Manufacturer
Amphenol Commercial Products
Series
SM2r
Datasheet
1.L17SM209S114T.pdf
(4 pages)
Specifications of L17SM209S114T
Connector Style
D-Sub
Number Of Positions
9
Number Of Rows
2
Shell Size, Connector Layout
1 (DE, E)
Contact Type
Signal
Connector Type
Receptacle, Female Sockets
Mounting Type
Surface Mount, Right Angle
Flange Feature
Board Side (4-40)
Termination
Solder
Features
Board Lock
Shell Material, Finish
Steel, Tin Plated
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Operating Temperature
185°F (85°C) Max
Voltage Rating
300V
Current Rating
3A
Housing Material
Thermoplastic, Glass Filled
Color
Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
L17SM209S114T
Manufacturer:
Amphenol Commercial Products
Quantity:
457
D-Sub connectors - Stamped and Formed Contacts
Specifications
• Connectors according to MIL C24308 - NFC 93425-HE5
SURFACE MOUNT CONNECTORS
Shells
Insulator
Socket contact
Rear insert
Boardlock
Screwlock
Grounding
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
Operating temperature 85°C, peak at 105°C
Damp heat
Single contact insertion force
Single contact withdrawal force
LIF boardlock
Coplanarity of contacts
Mating and unmating force
Unit: N
25 (size B)
No. of Cts
15 (size A)
9 (size E)
Steel with tin plating
High temperature (peak at 260°C) glass-filled
thermoplastic, UL 94V-0
Stamped and formed brass, selected gold in mating area;
2.54µm (100µ”) min. tin on termination area, with entire
contact under-plated 1.27µm (50µ”) min. nickel
Brass, 3µm up to 5µm (118µ” up to 197µ”) tinned over
nickel 2µm up to 3 µm (78µ” to 118µ”)
Tin plating 4µm up to 6µm (157µ” up to 236µ”) over nickel
2µm up to 3µm (78µ” up to 118µ”), insertion force:
Low Insertion Force = LIF (bronze)
Zero Insertion Force = ZeFo (bronze)
Brass, 6µm up to 10µm (236µ” up to 394µ”) tinned over
nickel 2µm up to 3µm (78µ” up to 118µ”)
Grounding strap: brass, 4µm up to 6µm tin plating over
nickel 2µm up to 3µm (78µ” up to 118µ”)
Materials and Platings
Electrical Data
3A
300V AC/rms 50Hz
1000V AC/rms 50Hz for one minute
5000MΩ
10mΩ max
Climatic Data
56 days (40°C - 95% HR)
Mechanical Data
Mate (max)
30
50
83
SM2
1.2N < F < 2.5N
0.4N min
8N max per connector
0.2mm (.008”) max
Unmate (min)
3.5
4.5
8.0
Amphenol SMT D-Sub is offered in
right angle, receptacle with brackets,
as an industry standard for I / O
connections.
Boardlock features:
-LIF (Low Insertion Force) boardlock
especially designed to be fully
compatible with pick and place
machine.
-ZeFo (Zero Force Insertion) boardlock
has been designed so that once placed
and expanded, secures a safe locking.
• Industrial
• Telecom
• Any industry standard
I / O connections
Pick and Place
Pick and Place
Designed for
Designed for
SMT process
SMT process
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L17SM209S114T Summary of contents
Page 1
... SM2 D-Sub connectors - Stamped and Formed Contacts SURFACE MOUNT CONNECTORS Specifications • Connectors according to MIL C24308 - NFC 93425-HE5 Materials and Platings Shells Steel with tin plating Insulator High temperature (peak at 260°C) glass-filled thermoplastic, UL 94V-0 Socket contact Stamped and formed brass, selected gold in mating area; ...
Page 2
Shell Size Dimensions PCB LAYOUT SHELL SIZE A B +0.05 (.002) 0 -0.1 (.004) -0.2 (.008) 31.15 (1.226) 16.4 (.645) E 39.4 (1.551) 24.8 (.976) A 53.3 (2.098) 38.5 (1.515 (inch PITCH ±0.1 (.004) 0 -0.25 ...
Page 3
Panel mounting option GROUNDING TABS: BOARDLOCKS: FLANGES ACCESSORIES: ...
Page 4
How to order L 17 SM2 RoHS Compliant configuration board locks / grounding tab grounding tab +ZeFo boardlocks (PCB = 1. ZeFo boardlocks only (PCB = 1. grounding tab ...