US5881LSE Melexis Inc, US5881LSE Datasheet - Page 8

• Manufacturer Part Number: US5881LSE
• Description: IC HALL EFFECT SW
• Manufacturer: Melexis Inc
• Type: Unipolar Switchr

Specifications of US5881LSE

• Sensing Range: 30mT Trip, 9.5mT Release
• Voltage - Supply: 3.5 V ~ 24 V
• Current - Supply: 5mA
• Current - Output (max): 50mA
• Output Type: Digital, Open Drain
• Operating Temperature: -40°C ~ 150°C
• Package / Case: SOT-23
• Features: -
• Other names: US5881LSETR

14 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
Iron Soldering THD’s (Through Hole Devices)
•
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
15 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901005881
Rev 007
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
Page 8 of 11
Unipolar Hall Switch – Low Sensitivity
US5881
Data Sheet
Feb/06