NCP15WM224J03RC Murata Electronics North America, NCP15WM224J03RC Datasheet - Page 22
![THERMISTOR 220K OHM NTC 0402 SMD](/photos/10/39/103982/ncp_gcm_grm_gjm_series_0402_sml.jpg)
NCP15WM224J03RC
Manufacturer Part Number
NCP15WM224J03RC
Description
THERMISTOR 220K OHM NTC 0402 SMD
Manufacturer
Murata Electronics North America
Series
NCP15r
Datasheet
1.NCP15WF104J03RC.pdf
(47 pages)
Specifications of NCP15WM224J03RC
Resistance In Ohms @ 25°c
220K
Resistance Tolerance
±5%
B Value Tolerance
±3%
B25/50
4500K
Operating Temperature
-40°C ~ 125°C
Power - Max
100mW
Mounting Type
Surface Mount
Package / Case
0402 (1005 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/75
-
B25/85
-
B25/100
-
Lead Length
-
Other names
490-2406-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NCP15WM224J03RC
Manufacturer:
MURATA
Quantity:
240 000
4
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
3. Recommended Temperature Profile for Soldering
(a) Insufficient preheating may cause a crack on ceramic
(b) Rapid cooling by dipping in solvent or by other means is
* In case of repeated soldering, the accumulated soldering
4. Solder and Flux
(1) Solder and Paste
(a) Reflow Soldering: NCP03/15/18/21 Series
(b) Flow Soldering: NCP18/21 Series
5. Cleaning Conditions
For removing the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics or
any change of the external electrodes' quality.
6. Drying
After cleaning, promptly dry this product.
20
• Please keep mounted parts and a substrate from an
• Please do not clean the products in the case of using a
Temp. Sensor and Compensation Chip Type !Caution/Notice
time should be within the range shown in the figure 2 above.
occurrence of resonance in ultrasonic cleaning.
non-washed type flux.
Use RA/RMA type or equivalent type of solder paste. For
your reference, we are using the solder paste below for
any internal tests of this product.
•RMA9086 90-4-M20 (Sn:Pb=63wt%:37wt%)
(Manufactured by Alpha Metals Japan Ltd.)
•M705-221BM5-42-11 (Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%)
(Manufactured by Senju Metal Industry Co., Ltd.)
We are using the solder paste below for any internal tests
of this product.
Continued from the preceding page.
body. The difference between preheating temperature
and maximum temperature in the profile shall be 100 C.
not recommended.
NCP18/21 Series
Flow Soldering Conditions
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
300
200
100
0
Preheating: 160 10 C, 1-2 min.
Soldering: 230-260 C, 10sec.
Preheating (in air)
1-2 min.
Soldering
*10sec.
Gradual Cooling
(in air)
(2) Flux
Solvent
Dipping Cleaning
Ultrasonic Cleaning
•Sn:Pb=63wt%:37wt%
•Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%
Use rosin type flux in soldering process.
If the flux listed below is used, some problems might be
caused in the product characteristics and reliability.
Please do not use the following flux.
NCP03/15 Series
Reflow Soldering Conditions
Reflow Soldering Conditions
• Strong acidic flux (with halide content exceeding
• Water-soluble flux
0.1wt%).
(*Water-soluble flux can be defined as non rosin type
flux including wash-type flux and non-wash-type flux.)
300
200
100
300
200
100
0
0
Preheating: 160 10 C, 1-2 min.
Soldering: 230-270 C, 20sec.
Preheating: 160 10 C, 1-2 min.
Soldering: 240-270 C, 20sec.
Isopropyl Alcohol
Less than 5 minutes at
room temp. or less than
2 minutes at 40 C max.
Less than 5 minutes and
20W/r
Frequency of 28kHz to
40kHz
Preheating (in air)
Preheating (in air)
NCP03/15
1-2 min.
1-2 min.
Soldering
Soldering
*20sec.
*20sec.
Continued on the following page.
Isopropyl Alcohol
Less than 5 minutes at
room temp. or less than
2 minutes at 40 C max.
Less than 1 minute and
20W/r
Frequency of several
10kHz to 100kHz
Gradual Cooling
Gradual Cooling
(in air)
(in air)
NCP18/21
R44E.pdf
2
11.2.21