NTCS0603E3104HXT Vishay, NTCS0603E3104HXT Datasheet - Page 6

• Manufacturer Part Number: NTCS0603E3104HXT
• Description: THERMISTOR NTC 100K OHM 0603 SMD
• Manufacturer: Vishay
• Series: 2381r
• Type: NTCr

Specifications of NTCS0603E3104HXT

• Resistance In Ohms @ 25°c: 100K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±1%
• B25/85: 4100K
• Operating Temperature: -40°C ~ 150°C
• Power - Max: 125mW
• Mounting Type: Surface Mount
• Package / Case: 0603 (1608 Metric)
• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Sensitivity Index: 4100K
• Resistance @ 25c: 100kohm
• Thermal Time Constant: 8s
• Percentage Of Resistance Tolerance @ 25c: ±3
• Accuracy: ±1
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 150C
• Product Length (mm): 1.6mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Rohs Compliant: Yes
• Thermistor Type: NTC
• Resistance: 100kohm
• Thermistor Tolerance: ± 3%
• Beta Value (k): 4100K
• Thermistor Case Style: 0603
• Operating Temperature Range: -40°C To +150°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/50: -
• B25/75: -
• B25/100: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 2381 615 36104; 238161536104; BC2291TR

SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Document Number: 29056
Revision: 10-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
P
50
0
1
P
Reflow Soldering
2
TEST METHOD
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
E
F
JWB288
This datasheet is subject to change without notice.
40 s
1.0
Resistance to soldering heat
1
SMD 0603, Glass Protected
W
200
Solderability
NTC Thermistors
0.8
Dimensions of the solder lands
TEST
T
T
250
1
2.4
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
0
0
1
0
1
2
0
0
cover tape
[e-mail]
(1)
(1)
(2)
pitch cumulative error over any 10 pitches ± 0.2 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
NTCS0603E3.....T
150
Time (s)
< 0.1
1.15
1.75
1.55
Min. 95 % of surface wetted
1.9
8.0
3.5
4.0
4.0
2.0
1.1
200
www.vishay.com/doc?91000
REQUIREMENTS
R/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350
15